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HFM2012中文资料
HFM2012数据手册规格书PDF详情
FEATURES
* Ideal for surface mounted applications
* Glass passivated device
* Low leakage current
* Metallurgically bonded construction
* Mounting position: Any
* Weight: 0.104 gram
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HFM2012 芯片相关型号
- 19-14-001-0402
- 539077
- 62100-2000
- HFM2000
- HFM2000D
- HFM2000W
- HFM2012C
- ISL70218SEHF/PROTO
- ISL70218SEHX/SAMPLE
- LNA-20-00101800-55-25P
- MICROBMC
- MICROC
- MICROFC-10010-SMT
- MICROFC-10020-SMT
- MICROFC-10035-SMT
- MICROFC-SMA-10010-GEVB
- MICROFC-SMA-10020-GEVB
- MICROFC-SMA-10035-GEVB
- MICROFC-SMTPA-10010-GEVB
- MICROFC-SMTPA-10020-GEVB
- MICROFC-SMTPA-10035-GEVB
- PZU4.7B1A/DG
- PZU4.7B2A/DG
- PZU4.7B3A/DG
- PZU4.7BA/DG
- PZU4.7DB2/DG
- SMCJ6.0A
- T520V337M004ATE007
- T520V337M006ATE045
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