High Frequency Wire Bondable RF Spiral Inductor, 0.030 x 0.030

FEATURES • High frequency • Wire bond assembly • Small size: 0.030 x 0.030 x 0.020 • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download • Sample kit available • Material categorization: for definitions of co

High Frequency Wire Bondable RF Spiral Inductor, 0.030\ x 0.030\

High frequency\nWire bond assembly\nSmall size: 0.030\" x 0.030\" x 0.020\";