RE060-LF

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 μm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 37 x 56 soldering pads 2.10 mm Ø Hole diameter 1.00 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

IGLOO Low Power Flash FPGAs with Flash*Freeze Technology

General Description The IGLOO family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA, a single-chip solution, small footprint packages, reprogrammability, and an abundance of advanced features. Features and Benefits Low Power • 1.2 V to 1.5 V Core Voltage Support

POLYSTYRENE/ POLYCARBONATE ENCLOSURE ABOX 060

文件：142.49 Kbytes Page：1 Pages

IGLOO nano Low Power Flash FPGAsnull

文件：7.69124 Mbytes Page：150 Pages

IGLOO nano Low Power Flash FPGAsnull

文件：7.69124 Mbytes Page：150 Pages

IGLOO PLUS Low Power Flash FPGAs with Flash*Freeze Technology

文件：4.39371 Mbytes Page：128 Pages