封装/外壳：宽 1812（4532 公制），1218 包装：卷带（TR） 描述：RES SMD 150K OHM 1W 1812 WIDE 电阻器 片式电阻器 - 表面贴装

封装/外壳：宽 1812（4532 公制），1218 包装：卷带（TR） 描述：RES SMD 150K OHM 1W 1812 WIDE 电阻器 片式电阻器 - 表面贴装

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Standard Thick Film Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

FEATURES ● Stability ΔR/R = 1 for 1000 h at 70 °C ● 2 mm pitch packaging option for 0603 size ● Pure tin solder contacts on Ni barrier layer    provides compatibility with lead (Pb)-free and lead    containing soldering processes ● Metal glaze on high quality ceramic ● AEC-Q200 qualified