Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

High component and equipment

FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glass contained in electrodes, resistors element and glass are exempted by RoHS  Reducing environmentally hazardous wastes  High component and equipment reliability  S

GENERAL PURPOSE CHIP RESISTORS

SCOPE This specification describes RC series chip resistors with lead free terminations made by thick film process. APPLICATIONS  All general purpose application FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glas

GENERAL PURPOSE CHIP RESISTORS

SCOPE This specification describes RC series chip resistors with lead free terminations made by thick film process. APPLICATIONS  All general purpose application FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glas

GENERAL PURPOSE CHIP RESISTORS

SCOPE This specification describes RC series chip resistors with lead free terminations made by thick film process. APPLICATIONS  All general purpose application FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glas

High component and equipment

FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glass contained in electrodes, resistors element and glass are exempted by RoHS  Reducing environmentally hazardous wastes  High component and equipment reliability  S

High component and equipment

FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glass contained in electrodes, resistors element and glass are exempted by RoHS  Reducing environmentally hazardous wastes  High component and equipment reliability  S

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

High component and equipment

FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glass contained in electrodes, resistors element and glass are exempted by RoHS  Reducing environmentally hazardous wastes  High component and equipment reliability  S

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

High Current, Highly Configurable System PMIC with Four Bucks and One LDO

General Description DA9080 is a five-channel advanced, configurable, system power management IC (PMIC) with four buck regulators and one LDO. This highly integrated, flexible PMIC is capable of up to 10 A of output current. The output voltage of the regulators can be programmed and sequenced ba

High component and equipment

FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glass contained in electrodes, resistors element and glass are exempted by RoHS  Reducing environmentally hazardous wastes  High component and equipment reliability  S

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

High component and equipment

FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glass contained in electrodes, resistors element and glass are exempted by RoHS  Reducing environmentally hazardous wastes  High component and equipment reliability  S

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

This document describes specifications for the F1650NLGI Zero/Complex IF Modulator implementing Zero-DistortionTM technology for low power consumption with improved ACLR. This device interfaces directly to a high performance Tx dual DAC.

FEATURES  Power Gain = 3.25dB  Direct 100Ω differential drive from Tx DAC 

DPD Demodulator for PA Linearization, 1300MHz to 2900MHz

FEATURES (I OR Q PATH) • Wide flat performance IF BW • Wide RF and LO BWs (~ 1.6 GHz) • Ideal for Multi-Carrier Systems •Drives ADC directly • Ultra linear + 41dBmIP3O • Low Noise Figure • Excellent ACLR performance • 200 Ω output impedance • Fully integrated DPD demodulator •6x6 36 pin

Ideal for Multi-Carrier Systems

FEATURES  Ideal for Multi-Carrier Systems  Lowside or Highside LO  11.8dB Gain  Ultra linear +43dBm IP3O using HS LO or +37.5 dBm IP3O using LS LO  9.7dB NF  200 Ω output impedance  Wide flat-performance IF BW  Drives ADC directly for DPD applications  Low Power Consumption  5

Ideal for Multi-Carrier Systems

FEATURES  Ideal for Multi-Carrier Systems  Lowside or Highside LO  11.7dB Gain  Ultra linear +45dBm IP3O using HS LO or +42dBm IP3O using LS LO  9.7 dB NF  200 Ω output impedance  Wide flat performance IF BW  Drives ADC directly for DPD applications  Low Power Consumption  5x5

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

RS9116 n-Link™ and WiSeConnect™ Wi-Fi® and Dual-Mode Bluetooth® 5 Wireless Connectivity B00 Module Solution

1.1 Features Wi-Fi • Compliant to single-spatial stream IEEE 802.11 b/g/n with single band support • Support for 20 MHz channel bandwidth • Transmit power up to +18 dBm with integrated PA • Receive sensitivity as low as -96 dBm • Data Rates: 802.11b: Up to 11 Mbps; 802.11g: Up to 54 Mbps; 80

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

GENERAL PURPOSE CHIP RESISTORS

SCOPE This specification describes RC series chip resistors with lead free terminations made by thick film process. APPLICATIONS  All general purpose application FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glas

High component and equipment

FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glass contained in electrodes, resistors element and glass are exempted by RoHS  Reducing environmentally hazardous wastes  High component and equipment reliability  S

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

High component and equipment

FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glass contained in electrodes, resistors element and glass are exempted by RoHS  Reducing environmentally hazardous wastes  High component and equipment reliability  S

LTE Cat-M1 / NB-IoT Antenna

APPLICATIONS •IoT •Healthcare •Smart Metering •Tracking •M2M •Industrial Devices •Tracking •SigFox •LoRa •Cellular •LPWAN •RPMA •LTE Cat-M1

High component and equipment

FEATURES  Halogen Free Epoxy  RoHS compliant  Products with lead free terminations meet RoHS requirements  Pb-glass contained in electrodes, resistors element and glass are exempted by RoHS  Reducing environmentally hazardous wastes  High component and equipment reliability  S

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT) High Efficiency/Linearity Amplifier The MMA25312B is a high efficiency InGaP HBT amplifier designed for use in 2400 MHz ISM applications, WLAN (802.11g), WiMAX (802.16e) and wireless broadband mesh networks. It is suitable for applications

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT) High Efficiency/Linearity Amplifier The MMA25312B is a high efficiency InGaP HBT amplifier designed for use in 2400 MHz ISM applications, WLAN (802.11g), WiMAX (802.16e) and wireless broadband mesh networks. It is suitable for applications

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT) High Efficiency/Linearity Amplifier The MMA25312B is a high efficiency InGaP HBT amplifier designed for use in 2400 MHz ISM applications, WLAN (802.11g), WiMAX (802.16e) and wireless broadband mesh networks. It is suitable for applications

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT) High Efficiency/Linearity Amplifier The MMA25312B is a high efficiency InGaP HBT amplifier designed for use in 2400 MHz ISM applications, WLAN (802.11g), WiMAX (802.16e) and wireless broadband mesh networks. It is suitable for applications

Chip Resistor Surface Mount

FEATURES  Total lead free without RoHS exemption  Halogen Free Epoxy  Reducing environmentally hazardous wastes  High component and equipment reliability  Saving of PCB space APPLICATIONS  All general purpose application

Cost and Size Optimized PMIC for SAMA5DX/SAM9X6/SAMA7G Series MPUs

Applications • High-Performance MPUs Power Supply Solutions • μC/μP, FPGA and DSP Power

Cost and Size Optimized PMIC for SAMA5DX/SAM9X6/SAMA7G Series MPUs

Applications • High-Performance MPUs Power Supply Solutions • μC/μP, FPGA and DSP Power

Low-Voltage Adjustable Precision Shunt Regulator

Description The RC0431A is a low-voltage 3-terminal adjustable precision voltage reference regulator. It has an excellent thermal stability over the standard commercial temperature range. The output voltage can be set to any value between Vref (1.24V) and 12V using two external resistors. Featu

Low-Voltage Adjustable Precision Shunt Regulator

Description The RC0431A is a low-voltage 3-terminal adjustable precision voltage reference regulator. It has an excellent thermal stability over the standard commercial temperature range. The output voltage can be set to any value between Vref (1.24V) and 12V using two external resistors. Featu

GENERAL PURPOSE CHIP RESISTORS

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Thick Film Chip Resistor General Purpose

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THICK-FILM CHIP RESISTOR

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Low-power sleep mode On-hook transmission Loop or ground start operation Smooth polarity reversal

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GENERAL PURPOSE CHIP RESISTORS

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GENERAL PURPOSE CHIP RESISTORS

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