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QC7A12.0000F08B50AR中文资料
QC7A12.0000F08B50AR数据手册规格书PDF详情
Features
• Low in height, suitable for thin equipment
• Ceramic package and metal lid assures high
reliability
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment
• PMCIA, wireless applications
• Automotive applications
QC7A12.0000F08B50AR 资料下载更多...
QC7A12.0000F08B50AR 芯片相关型号
- KME02CCG1E103KL
- KME02CCG1E103KM
- KME02CCG1E103KT
- QC7A12.0000F08B50AM
- QC7A12.0000F08B51AM
- QC7A12.0000F08B51AR
- QC7A12.0000F08B52AM
- QC7A12.0000F08B52AR
- QC7A12.0000F08B53AM
- QC7A12.0000F08B53AR
- QC7A12.0000F08B55AM
- QC7A12.0000F08B55AR
- S25FL512SAGMFB311
- S25FL512SAGMFB313
- S25FL512SAGMFB410
- S25FL512SAGMFB411
- S25FL512SAGMFB413
- S25FL512SAGMFB610
- S25FL512SAGMFB611
- S25FL512SAGMFB613
- S25FL512SAGMFB710
- S25FL512SAGMFB711
- S25FL512SAGMFB713
- S25FL512SAGMFB810
- S25FL512SAGMFB811
- S25FL512SAGMFB813
- SS310
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