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QC7A12.0000F08B33AR中文资料
QC7A12.0000F08B33AR数据手册规格书PDF详情
Features
• Low in height, suitable for thin equipment
• Ceramic package and metal lid assures high
reliability
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment
• PMCIA, wireless applications
• Automotive applications
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QC7A12.0000F08B33AR 芯片相关型号
- PTPSI2260QDWQRQ1
- PWCT2134AFVLHPNR
- PWCT2134AFVLHPNT
- PWCT2134AFVLHPR
- PWCT2134AFVLHPT
- PWCT2134AFVLLPNR
- PWCT2134AFVLLPNT
- PWCT2134AFVLLPR
- PWCT2134AFVMHPNR
- QC7A12.0000F08B21AM
- QC7A12.0000F08B21AR
- QC7A12.0000F08B22AM
- QC7A12.0000F08B22AR
- QC7A12.0000F08B23AM
- QC7A12.0000F08B23AR
- QC7A12.0000F08B25AM
- QC7A12.0000F08B25AR
- QC7A12.0000F08B30AM
- QC7A12.0000F08B30AR
- QC7A12.0000F08B31AM
- QC7A12.0000F08B31AR
- QC7A12.0000F08B32AM
- QC7A12.0000F08B32AR
- QC7A12.0000F08B33AM
- XL3F0216STP1IW-XCE
- XL3F0216STP1IW-XCL
- XL3F0216STP1IW-XNH
- XL3F0216STP1IW-XV9
- XL3F0216STP1IW-XX1
- XL3F0216STP1IW-XX2
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