Ultra low power Bluetooth LE system-on-chip solution

Ultra low power Bluetooth LE system-on-chip solution

RF片上系统 - SoC Ultra Low Power BLE System-on-Chip

封装/外壳：32-VFQFN 裸露焊盘 包装：卷带（TR） 描述：ULTRA LOW POWER BLUETOOTH LE SYS RF/IF，射频/中频和 RFID 射频收发器 IC

RF片上系统 - SoC Ultra low power Bluetooth LE system-on-chip solution

包装：托盘 描述：QN9021BN/EY RF/IF，射频/中频和 RFID 射频收发器 IC

INSULATED PC SPACERS/SUPPORTS

INSULATED PC SPACERS / SUPPORTS • Board will be electrically insulated, eliminates need for insulating washers • Easy snap-in assembly • No tool required for installation • Designed for .062(1.57) thick boards • One piece design eliminates the need for additional screws and nuts • Slim desig

Piezoelectric force sensors Piezoelectric ring force transducers for tensile and compression forces from 7.5 kN to 1 200 kN

SAW Components Low-Loss Filter for Mobile Communication 1842,5 MHz

Features ■ Low-loss RF filter for mobile telephone PCN systems, receive path ■ High selectivity ■ Low amplitude ripple ■ Usable passband 75 MHz ■ Unbalanced to balanced operation ■ No external matching required ■ Suitable for GPRS class 1 to 12 ■ Package for Surface Mounted Technology (SMT

MOTIX™ integrated full-bridge IC BTM9020/BTM9021

Features • Path resistance of typ. 84 mΩ at 25°C • Pulse current: - 8.8 A for tpulse ≤ 1 s at 85°C - 6.9 A for tpulse ≤ 10 s at 85°C • Supply voltage range from 7 V to 18 V • Extended supply voltage range from 4.5 V to 40 V • Current limitation of min. 20 A • Slew rate selection • Protect

Snap Rivets

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