60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

12,000 usable PLD gate pASIC 3 FPGA combining high performance and high density.

12,000 usable PLD gate pASIC3 FPGA combining high performance and high density.

Power entry modules without line filter

IEC Appliance Inlet C14 with Fuseholder 2-pole Description - Panel Mount: Screw-on mounting from front side - 2 Functions: Appliance Inlet protection class I or II, Fuseholder for fuse-links 5 x 20 mm, 1- or 2-pole - Quick connect terminals 4.8 x 0.8 mm - We recommend

Power Cord with IEC Connector C13, Angled

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3/8 Square Drive Sockets, SAE

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POWER APPLICATIONS

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true one-port, surface-acoustic-wave (SAW) resonator

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