位置：BYG85B > BYG85B详情
BYG85B中文资料
BYG85B数据手册规格书PDF详情
DESCRIPTION
DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape.
更新时间：2026-5-13 16:43:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PHI |
SOD106A |
99000 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
PHI |
16+ |
SOD106A |
99000 |
鍏ㄦ柊鍘熻鐜拌揣/浠锋牸鍙皥! |
|||
PHI |
20+ |
SOD106A |
36800 |
原装优势主营型号-可开原型号增税票 |
|||
PHI |
24+ |
DO214A |
598000 |
原装现货假一赔十 |
|||
PHI |
2019+PB |
SOD106A |
99000 |
全新-特价大量供货房间 |
|||
PHI |
2450+ |
DO214/A |
6540 |
只做原装正品现货或订货!终端客户免费申请样品! |
|||
PHI |
23+ |
原厂正规渠道 |
5000 |
专注配单,只做原装进口现货 |
|||
恩XP |
24+ |
SMD |
6200 |
新进库存/原装 |
|||
25+23+ |
1WR |
30332 |
绝对原装正品全新进口深圳现货 |
||||
SMD |
23+ |
NA |
15659 |
振宏微专业只做正品,假一罚百! |
BYG85B 资料下载更多...
BYG85B 芯片相关型号
PHILIPS相关芯片制造商
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107
- P108
- P109
