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BYG80C中文资料
BYG80C数据手册规格书PDF详情
DESCRIPTION
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape.
更新时间：2026-1-30 8:30:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PHI |
16+ |
SOD106 |
15000 |
进口原装现货/价格优势! |
|||
PHI |
2019+PB |
SOD106 |
99000 |
原装正品 可含税交易 |
|||
PHI |
24+ |
76700 |
|||||
PHI |
23+ |
SOD106 |
7300 |
专注配单,只做原装进口现货 |
|||
PHI |
2026+ |
SOD106 |
15000 |
原装正品,假一罚十! |
|||
PHI |
24+ |
SOD106 |
99000 |
原装现货假一赔十 |
|||
PHI |
新年份 |
SOD106 |
99000 |
原装正品大量现货,要多可发货,实单带接受价来谈! |
|||
PHI |
24+ |
DO-214ACSMA |
5000 |
只做原装公司现货 |
|||
PHI |
0407+ |
SMA |
1500 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
PHI |
A20E |
SMA |
1507 |
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