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BYG50M数据手册规格书PDF详情
DESCRIPTION
DO-214AC; SOD106 surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape.
更新时间：2026-3-3 15:08:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PHI |
2025+ |
SOD106 |
5000 |
原装进口价格优 请找坤融电子! |
|||
PHI |
09+ |
DO-214AC |
100000 |
绝对全新原装强调只做全新原装现 |
|||
PHI |
19+ |
SOD106 |
200000 |
||||
PHI |
23+ |
SOD106 |
7300 |
专注配单,只做原装进口现货 |
|||
PHI |
2026+ |
DO-214 |
40000 |
原装正品,假一罚十! |
|||
PHI |
SOD106 |
99000 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
PHI |
24+ |
SOD106 |
22055 |
郑重承诺只做原装进口现货 |
|||
PHI |
23+ |
DO-214 |
50000 |
全新原装正品现货,支持订货 |
|||
PHI |
24+ |
DO214 |
65200 |
一级代理/放心采购 |
|||
PHI |
24+ |
SOD106 |
99000 |
原装现货假一赔十 |
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