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BYG50G中文资料
BYG50G数据手册规格书PDF详情
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape.
更新时间：2026-2-12 15:14:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PHI |
16+ |
SOD106 |
15000 |
进口原装现货/价格优势! |
|||
PHI |
2019+PB |
SOD106 |
99000 |
原装正品 可含税交易 |
|||
PHI |
08+ |
DO-214AC |
100000 |
绝对全新原装强调只做全新原装现 |
|||
恩XP |
24+ |
DO-214AC |
15200 |
新进库存/原装 |
|||
VISHAY |
23+ |
DO-214AC |
50000 |
全新原装深圳现货库存,特价· |
|||
DO-214AC |
23+ |
NA |
15659 |
振宏微专业只做正品,假一罚百! |
|||
N/A |
25+23+ |
NA |
34172 |
绝对原装正品全新进口深圳现货 |
|||
恩XP |
23+ |
50000 |
全新原装正品现货,支持订货 |
||||
PHI |
25+ |
SOD106 |
3000 |
全新原装、诚信经营、公司现货销售 |
|||
恩XP |
32 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
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BYG50G 芯片相关型号
- 04023J8R2GBWTR
- 0402ZJ680JBWTR
- 06151129
- 06153026
- 06153127
- 06153225
- 2095-140-BT1LF
- B12EH-GG
- B13HV-GG
- B1RA1H-GG
- B25LH-GG
- B2SLV-GG
- BY500-800
- H810RCYD
- H81K0BBD
- MSP430F2122TRTV
- MSP430F2471TPMR
- MSP430F5333IZQWT
- MSP430F5636
- MSP430F6631IPZ
- MSP430F6633IPZR
- MSP430F6730IPZR
- MSP430F6736CY
- PS-15020-001
- SQHR201M0G
- SQHR501K0J
- SQHW20140G
- TCA1116PWR
- THS3201MDGNEP(1)
- THS4041IDRQ1
TAYCHIPST相关芯片制造商
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