Microelectronic Power IC

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封装/外壳：16-DIP（0.300"，7.62mm），10 引线 包装：管件 描述：SSR RELAY DPST-NO 180MA 0-200V 继电器 固态继电器

封装/外壳：16-DIP（0.300"，7.62mm），10 引线 包装：管件 描述：SSR RELAY DPST-NO 180MA 0-200V 继电器 固态继电器

Microelectronic Power IC

HEXFET짰 Power MOSFET Photovoltaic Relay Dual-Pole, Normally-Open 0-300V AC/DC, 165mA

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HEXFET짰 Power MOSFET Photovoltaic Relay Dual-Pole, Normally-Open 0-300V AC/DC, 165mA

文件：94.24 Kbytes Page：6 Pages

HEXFET® Power MOSFET Photovoltaic Relay Dual-Pole, Normally-Open 0-300V AC/DC, 165mA

PRESSURE SENSORS

Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in

PRESSURE SENSORS

Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in

Complementary enhancement mode MOS transistors

DESCRIPTION One N-channel and one P-channel enhancement mode MOS transistor in an 8-pin plastic SOT96-1 (SO8) package. FEATURES • High-speed switching • No secondary breakdown. APPLICATIONS • Universal line interface in telephone sets • Relay, high-speed and line transfo

DUAL HOT SWAP POWER CONTROLLER WITH INDEPENDENT CIRCUIT BREAKER AND POWER-GOOD REPORTING

文件：422.89 Kbytes Page：22 Pages

DUAL HOT SWAP POWER CONTROLLER WITH INDEPENDENT CIRCUIT BREAKER AND POWER-GOOD REPORTING

文件：422.89 Kbytes Page：22 Pages