Electrically Isolated Back Surface Single MOSFET Die

文件：149.55 Kbytes Page：4 Pages

THM TEST POINTS

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

XTR111 Demonstration Fixture Users Guide

2 Hardware Features This section describes the hardware features found on the XTR111EVM. 2.1 XTR111EVM The XTR111EVM is used for the basic functional evaluation of the XTR111. The EVM provides the following features: • Easy handling of the small DFN package. The DFN device is already soldered

DRV411EVM Users Guide

文件：574.61 Kbytes Page：13 Pages

J5800-001 INSERTION TOOL PRODUCT SPECIFICATION

文件：23.08 Kbytes Page：1 Pages

Compact Intelligent Power Module (IPM) Motor Control Development Kit (MDK) 1 kW

文件：2.79432 Mbytes Page：28 Pages