Generation DIP and Mini-DIP-IPM

Features: • Ultra Compact Transfer Mold Package • Including Drive and Protection ICs (low and high voltage drive ICs) • Low and High Speed Types • All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals • From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with complet

封装/外壳：35-PowerDIP 模块（1.370"，34.80mm） 包装：散装 描述：MOD IPM 600V 10A MINI-DIP 分立半导体产品 功率驱动器模块

Intellimod??Module Dual-In-Line Intelligent Power Module (10 Amperes/600 Volts)

Description: DIP and mini-DIP IPMs are intelligent power modules that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 4th generation IGBTs, DIP packaging, and application specific

Intellimod??Module

Description: DIP and mini-DIP IPMs are intelligent power modules that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 4th generation IGBTs, DIP packaging, and application specific

Generation DIP and Mini-DIP-IPM

Features: • Ultra Compact Transfer Mold Package • Including Drive and Protection ICs (low and high voltage drive ICs) • Low and High Speed Types • All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals • From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with complet

600V/10A low-loss 4th generation (planar) IGBT inverter bridge for 3 phase DC-to-AC power conversion.

文件：180.6 Kbytes Page：9 Pages