Generation DIP and Mini-DIP-IPM

Features: • Ultra Compact Transfer Mold Package • Including Drive and Protection ICs (low and high voltage drive ICs) • Low and High Speed Types • All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals • From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with complet

Intellimod??Module Dual-In-Line Intelligent Power Module (5 Amperes/600 Volts)

文件：89.65 Kbytes Page：6 Pages

Generation DIP and Mini-DIP-IPM

Features: • Ultra Compact Transfer Mold Package • Including Drive and Protection ICs (low and high voltage drive ICs) • Low and High Speed Types • All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals • From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with complet

Intellimod??Module Dual-In-Line Intelligent Power Module (5 Amperes/600 Volts)

文件：89.65 Kbytes Page：6 Pages

Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE

文件：180.45 Kbytes Page：9 Pages