位置:首页 > IC中文资料第2124页 > PIC670
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
PIC670 | POWER INTEGRATED CIRCUIT Semiconductor Devices, Silicon Hybrid Switching Regulators High Reliability Types SCOPE This specification defines the detail requirements for High Reliability Hybrid Switching Regulators. Very extensive 100 testing for parameter stability has been included in the quality Assurance Provisions. | MICROSEMI 美高森美 | ||
PIC670 | Semiconductor Devices, Silicon hybrid Switching Regulators High Reliability Types 文件:408.02 Kbytes Page:9 Pages | MICROSEMI 美高森美 | ||
PIC670 | BJT Modules (Power Integrated Circuit, PIC) | MICROCHIP 微芯科技 | ||
FAST RECOVERY DIODE FAST RECOVERY DIODE FOR IGBT,IEGT,GCT APPLICATIONS SNUBBERLESS OPERATION LOW LOSSES SOFT RECOVERY Repetitive voltage up to 4500 V Mean forward current 1315 A Surge current 15 kA | POSEICO | |||
COMPLEMENTARY SILICON POWER DARLINGTON TRANSISTORS Description The devices are manufactured in planar base island technology with monolithic Darlington configuration. Features ■ Good hFE linearity ■ High fT frequency ■ Monolithic Darlington configuration with integrated antiparallel collector-emitter diode Applications ■ Line | STMICROELECTRONICS 意法半导体 | |||
Multi TOPLED Multi TOPLED® Features ●P-LCC-4 package ●color of package: white ●for use as optical indicator ●for backlighting, optical coupling into light pipes and lenses ●both chips can be controlled separately ●high signal efficiency possible by color change of the LED ●with approp | SIEMENS 西门子 | |||
Multi TOPLED Multi TOPLED® Features ●P-LCC-4 package ●color of package: white ●for use as optical indicator ●for backlighting, optical coupling into light pipes and lenses ●both chips can be controlled separately ●high signal efficiency possible by color change of the LED ●with approp | SIEMENS 西门子 | |||
DUAL HIGH SIDE SWITCH WITH DUAL POWER MOS GATE DRIVER BRIDGE CONFIGURATION Description The VND670SP is a monolithic device made using STMicroelectronics VIPower technology M0-3, intended for driving motors in full bridge configuration. The device integrates two 30 mW Power MOSFET in high-side configuration, and provides gate drive for two external Power MOSFET used as l | STMICROELECTRONICS 意法半导体 |
PIC670产品属性
- 类型
描述
- 型号
PIC670
- 制造商
Microsemi Corporation
- 功能描述
CONV DC-DC SGL-OUT 4PIN TO-66 - Bulk
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MSC/UNI |
20+ |
TO-66 |
35830 |
原装优势主营型号-可开原型号增税票 |
|||
MICROCHIP/微芯 |
26+ |
QFP |
43600 |
全新原装现货,假一赔十 |
|||
MICROCHIP |
2023+ |
PLCC-68 |
50000 |
原装现货 |
|||
NO |
24+ |
TO-66 |
27 |
||||
MSC/UNI |
专业铁帽 |
TO-66 |
1200 |
原装铁帽专营,代理渠道量大可订货 |
|||
MICROCHIP/微芯 |
23+ |
SOP-8 |
18500 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
MICRO |
13+ |
6738 |
原装分销 |
PIC670规格书下载地址
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DdatasheetPDF页码索引
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