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型号 功能描述 生产厂家 企业 LOGO 操作
PAL16R8A

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

PAL16R8A

标准高速 PAL 电路

TI

德州仪器

PAL16R8A

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

PAL16R8A

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

丝印代码:PAL16R8AMJ;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:PAL16R8AMJ;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

标准高速 PAL 电路

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Thei • Choice of Operating Speeds \n• Half-Power, A-2 Devices . . . 16 MHz Min\n• Choice of Input/Output Configuration\n• Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package\n DEVICE I INPUTS 3-STATE O OUTPUTS REGISTERED Q OUTPUTS I/O PORT S PAL16L8 1;

TI

德州仪器

丝印代码:81036082A;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:81036082A;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:8103608RA;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

丝印代码:8103608RA;STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

可编程逻辑器件(CPLD/FPGA)

AMD

超威半导体

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

Progammable Array Logic Series 24 (PAL Series 24)

文件:448.59 Kbytes Page:14 Pages

NSC

国半

STANDARD HIGH-SPEED PAL CIRCUITS

文件:357.21 Kbytes Page:18 Pages

TI

德州仪器

PAL16R8A产品属性

  • 类型

    描述

  • Operating temperature range (C):

    -55 to 125

更新时间:2026-5-14 18:10:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
NS
26+
CDIP
9823
代理全系列销售,全新原装正品,价格优势,长期供应,量大可订
TI
23+
NA
20000
TI
25+
LCC20
20000
原装
MMI
23+
DIP-20
7000
绝对全新原装!100%保质量特价!请放心订购!
AMD
02+
DIP/20
100
原装现货海量库存欢迎咨询
TI
23+
LCC20
5000
全新原装,支持实单,非诚勿扰
MMI
2450+
DIP20
8850
只做原装正品假一赔十为客户做到零风险!!
NS
25+23+
DIP20
21915
绝对原装正品全新进口深圳现货
TEXAS INSTRUMENTS
2023+
SMD
11239
安罗世纪电子只做原装正品货
TI/德州仪器
2025+
CDIP
1000
原装进口价格优 请找坤融电子!

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