STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

标准高速 PAL 电路

Progammable Array Logic Series 24 (PAL Series 24)

文件：448.59 Kbytes Page：14 Pages

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes Page：18 Pages

丝印代码：PAL16R8AMJ；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

丝印代码：PAL16R8AMJ；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

丝印代码：81036082A；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

丝印代码：81036082A；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

丝印代码：8103608RA；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

丝印代码：8103608RA；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes Page：18 Pages

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes Page：18 Pages

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes Page：18 Pages

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes Page：18 Pages

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes Page：18 Pages

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes Page：18 Pages

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes Page：18 Pages

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes Page：18 Pages