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BC856XQC中文资料
BC856XQC数据手册规格书PDF详情
Features and benefits
• High power dissipation capability
• Suitable for Automatic Optical Inspection (AOI) of solder joint
• Smaller footprint compared to conventional leaded SMD packages
• Low package height of 0.5 mm
更新时间：2026-1-31 14:16:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Nexperia |
24+ |
NA |
3000 |
进口原装正品优势供应 |
|||
NEXPERIA |
20+ |
SMD |
11520 |
特价全新原装公司现货 |
|||
PHI |
24+ |
SOT-23 |
15032 |
大批量供应优势库存热卖 |
|||
PHI |
24+ |
SOT-23 |
6430 |
原装现货/欢迎来电咨询 |
|||
恩XP |
24+ |
SOT-23 |
65200 |
一级代理/放心采购 |
|||
CJ/长电 |
23+ |
SOT-23 |
12730 |
原装正品代理渠道价格优势 |
|||
恩XP |
25+ |
SOT-23 |
300 |
优势 |
|||
ZRE(治润) |
2447 |
SOT-23 |
105000 |
3000个/圆盘一级代理专营品牌!原装正品,优势现货, |
|||
恩XP |
21+ |
SMD |
3000 |
百域芯优势 实单必成 可开13点增值税 |
|||
CJ |
21+ |
SOT-23 |
3000 |
只做原装,一定有货,不止网上数量,量多可订货! |
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BC856XQC 芯片相关型号
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