XC6SLX16-2CS
规格
产品属性属性值搜索类似
制造商:Xilinx
产品种类:FPGA - 现场可编程门阵列
RoHS: 详细信息
产品:Spartan-6
逻辑元件数量:14579
输入/输出端数量:232 I/O
工作电源电压:1.2 V
较小工作温度:0 C
较大工作温度:+ 85 C
安装风格:SMD/SMT
封装 / 箱体:CSBGA-324
系列:XC6SLX16
商标:Xilinx
分布式RAM:136 kbit
内嵌式块RAM - EBR:576 kbit
较大工作频率:1080 MHz
湿度敏感性:Yes
产品类型:FPGA - Field Programmable Gate Array
工厂包装数量:126
子类别:Programmable Logic ICs
商标名:Spartan
芯片详细信息
Manufacturer Part Number:
XC6SLX16-2CSG324C
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Ihs Manufacturer:
XILINX INC
Part Package Code:
BGA
Package Description:
LFBGA， BGA324，18X18，32
Pin Count:
324
Reach Compliance Code:
compliant
ECCN Code:
3A991.D
HTS Code:
8542.39.00.01
Factory Lead Time:
[object Object]
Manufacturer:
Xilinx
Risk Rank:
0.99
Samacsys PartID:
701844
Samacsys Pin Count:
324
Samacsys Part Category:
Integrated Circuit
Samacsys Package Category:
BGA
Samacsys Footprint Name:
324 Ball Chip-Scale BGA (CSG324) Package，
Samacsys Released Date:
2020-01-04 07:00:51
Is Samacsys:
N
Clock Frequency-Max:
667 MHz
Combinatorial Delay of a CLB-Max:
0.26 ns
JESD-30 Code:
S-PBGA-B324
JESD-609 Code:
e1
Length:
15 mm
Moisture Sensitivity Level:
3
Number of CLBs:
1139
Number of Inputs:
232
Number of Logic Cells:
14579
Number of Outputs:
232
Number of Terminals:
324
Operating Temperature-Max:
85 °C
Organization:
1139 CLBS
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFBGA
Package Equivalence Code:
BGA324，18X18，32
Package Shape:
SQUARE
Package Style:
GRID ARRAY， LOW PROFILE， FINE PITCH
Peak Reflow Temperature (Cel):
260
Power Supplies:
1.2，2.5/3.3 V
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
1.5 mm
Subcategory:
Field Programmable Gate Arrays
Supply Voltage-Max:
1.26 V
Supply Voltage-Min:
1.14 V
Supply Voltage-Nom:
1.2 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
OTHER
Terminal Finish:
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
15 mm
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