DESCRIPTION

The UPA839TF contains one NE680 and one NE856 NPN high frequency silicon bipolar chip. NECs new low profile TF package is ideal for all portable wireless applications where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/buffer amplifier and other applications.

FEATURES

• SMALL PACKAGE OUTLINE:

SOT-363 package measures just 2.0 mm x 1.25 mm

• LOW HEIGHT PROFILE:

Just 0.60 mm high

• TWO DIFFERENT DIE TYPES:

Q1 - Ideal oscillator transistor

Q2 - Ideal buffer amplifier transistor