DESCRIPTION

The UPA838TF contains one NE688 and one NE687 NPN high frequency silicon bipolar chip. NECs new low profile TF package is ideal for all portable wireless applications where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/buffer amplifier and other applications.

FEATURES

• SMALL PACKAGE OUTLINE:

SOT-363 package measures just 2.0 mm x 1.25 mm

• LOW HEIGHT PROFILE:

Just 0.60 mm high

• TWO DIFFERENT DIE TYPES:

Q1 - Ideal oscillator transistor

Q2 - Ideal buffer amplifier transistor