Bluetooth 5.3 SoC supporting Bluetooth Low Energy, Bluetooth mesh, Thread and Zigbee, qualified for up to 105°C.

features -Arm processor - 64 MHz Arm® Cortex-M4 with FPU - 256 KB Flash + 32 KB RAM -Bluetooth 5.3 Radio - Direction Finding - Long Range - Bluetooth mesh - +8 dBm TX power - -95 dBm sensitivity (1 Mbps) -IEEE 802.15.4 radio support - Thread - Zigbee -Full range of digital in

Bluetooth 5.1 SoC supporting Bluetooth Low Energy, Bluetooth mesh, Thread and Zigbee, qualified up to 105°C ambient temperature.

KEY FEATURES 64 MHz Arm® Cortex-M4 with FPU 512 KB Flash + 128 KB RAM Bluetooth 5.1 radio Direction Finding Long Range Bluetooth mesh +8 dBm TX power -95 dBm sensitivity (1 Mbps) 4.8 mA in TX (0 dBm) 4.6 mA in RX (1 Mbps) Integrated balun with single-ended output IEEE 802.15.4

Development dongle for Bluetooth 5/Bluetooth mesh/Thread/Zigbee/802.15.4/ANT/2.4GHz

KEY FEATURES Bluetooth 5 ready multiprotocol radio 2 Mbps Long Range Advertising Extensions Channel Selection Algorithm #2 (CSA #2) IEEE 802.15.4 radio support Thread Zigbee Arm® CortexTM-M4 with floating point support DSP instruction set Arm CryptoCell CC310 cryptographic acceler

Bluetooth 5.2 SoC supporting Bluetooth Low Energy, Bluetooth Direction Finding and Thread

封装/外壳：33-UFBGA，WLCSP 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC BLUETOOTH V5.1 RF/IF，射频/中频和 RFID 射频收发器 IC

封装/外壳：32-VFQFN 裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：BLUETOOTH 5.3 SOC SUPPORTING BLU RF/IF，射频/中频和 RFID 射频收发器 IC