Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers

The NIS3001 is an integrated multi−chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are packaged in a power QFN package called PInPAK. The 10.5 by 10.5 mm PInPAK™ package increases power densi

Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers

Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers

The NIS3001 is an integrated multi−chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are packaged in a power QFN package called PInPAK. The 10.5 by 10.5 mm PInPAK™ package increases power densi

KK Maxi-3.96mm & 5.08mm Modular Interconnection System

KEY FEATURES ■ Available on 3.96 mm and 5.08 mm center spacings ■ Polarisation via insertable keys and pegs ■ Allows connections anywhere on the board ■ Double cantilever style terminal ■ Selective gold plating options ■ End-to-end stacking capabilities ■ Locking ramp for improved mated ret

RF Manual 16th edition

MICROWAVE CW BIPOLAR

[ACRIAN INC] GENERAL DESCRIPTION The 3001 is a common base transistor capable of providing 1 Watts of CW RF output power at 3000 MHz. This hermetically sealed transistor is specifically designed telemetry and telecommunications applications. It uses gold metalization and diffused ballasting to p

1 Watt - 28 Volts, Class C Microwave 3000 MHz

GENERAL DESCRIPTION The 3001 is a COMMON BASE transistor capable of providing 1 Watts Class C, RF output power at 3000 MHz. Gold metalization and diffused ballasting are used to provide high reliability and supreme ruggedness. The transistor uses a fully hermetic High Temperature Solder Sealed pa

KNOB

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