NIN-H价格

参考价格:¥0.4655

型号:NIN-HC470GTRF 品牌:NIC Components 备注:这里有NIN-H多少钱,2025年最近7天走势,今日出价,今日竞价,NIN-H批发/采购报价,NIN-H行情走势销售排行榜,NIN-H报价。
型号 功能描述 生产厂家 企业 LOGO 操作
NIN-H

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIC

NIN-H产品属性

  • 类型

    描述

  • 型号

    NIN-H

  • 制造商

    NIC

  • 制造商全称

    NIC-Components Corp.

  • 功能描述

    Wirewound Chip Inductors

更新时间:2025-12-26 19:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
NICC
24+
SMD
20000
全新原厂原装,进口正品现货,正规渠道可含税!!
NIC COMPONENTS
2450+
NA
9850
只做原厂原装正品现货或订货假一赔十!
NIC COMPONENTS
25+
2020
公司优势库存 热卖中!
NIC
0616ROHS
SMD
1980
MICC(原装正品)
23+
SMD
65400
NICC
23+
SMD
28000
原厂授权一级代理,专业海外优势订货,价格优势、品种
NICCOMPONENTSCORP
23+
NA
12730
原装正品代理渠道价格优势
NIC
24+
N/A
10000
只做原装,实单最低价支持
NICCOMPONENTSCORP
24+
NA
48000
原装现货,专业配单专家
NICCOMPONENTSCORP
21+
NA
9000
只做原装,一定有货,不止网上数量,量多可订货!

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