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NIN-H价格

参考价格：￥0.4655

型号：NIN-HC470GTRF 品牌：NIC Components 备注：这里有NIN-H多少钱，2026年最近7天走势，今日出价，今日竞价，NIN-H批发/采购报价，NIN-H行情走势销售排行榜，NIN-H报价。

型号	功能描述	生产厂家企业	LOGO
NIN-H	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC100JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC120JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC150JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC180JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC1R0JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC1R2JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC1R5JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC1R8JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC220JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC270JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC2R2JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC2R7JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC330JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC390JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC3R3JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC3R9JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC470JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC4R7JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC560JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC680JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HC820JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR10JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR12JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR15JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR18JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR22JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR27JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR33JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR39JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR47JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR56JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR62JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR68JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR75JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR82JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HCR91JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD100JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD120JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD150JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD180JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD220JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD270JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD2N2JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD330JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD390JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD3N3JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD470JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD4N7JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD560JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD680JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD6N8JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD820JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HD8N2JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HDR10JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HDR12JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HDR15JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HDR18JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HDR22JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC
NIN-HDR27JTRF	Wirewound Chip Inductors FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE	NIC	NIC

NIN-H产品属性

类型
描述
型号
NIN-H
制造商
NIC
制造商全称
NIC-Components Corp.
功能描述
Wirewound Chip Inductors

NIN-H供应商更多...

更新时间：2026-8-2 20:28:00

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Nippon Chemi-Con黑金刚HHXC350ARA271MJA0G代理渠道18138231376

NHPXA270C5C520 稳压IC 可长期支持国外订货，专业渠道价格优，周期短，欢迎咨询

NIS3001-集成驱动器和MOSFET的同步降压控制器的电源芯片

DdatasheetPDF页码索引