Headset Detection Interface Interface

文件：401.01 Kbytes Page：7 Pages

耳机检测接口

封装/外壳：6-UFDFN 功能：检测开关 包装：管件 描述：IC DETECTION SWITCH 6UDFN 集成电路（IC） 音频专用

Headset Detection Interface Interface

文件：401.01 Kbytes Page：7 Pages

封装/外壳：6-UFDFN 功能：检测开关 包装：托盘 描述：IC DETECTION SWITCH 6UDFN 集成电路（IC） 音频专用

PRESSURE SENSORS

Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in

PRESSURE SENSORS

Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in

Complementary enhancement mode MOS transistors

DESCRIPTION One N-channel and one P-channel enhancement mode MOS transistor in an 8-pin plastic SOT96-1 (SO8) package. FEATURES • High-speed switching • No secondary breakdown. APPLICATIONS • Universal line interface in telephone sets • Relay, high-speed and line transfo

DUAL HOT SWAP POWER CONTROLLER WITH INDEPENDENT CIRCUIT BREAKER AND POWER-GOOD REPORTING

文件：422.89 Kbytes Page：22 Pages

DUAL HOT SWAP POWER CONTROLLER WITH INDEPENDENT CIRCUIT BREAKER AND POWER-GOOD REPORTING

文件：422.89 Kbytes Page：22 Pages