Compatible with MLCC footprint

 Ultra-high stability of capacitace value:

o Temperature 70ppm/K (-55 °C to

+150 °C)

o Voltage <0.02/Volt

o Negligible capacitance loss through

ageing

Low profile 0.1mm

Small size 0.25 x 0.25 mm (0101 format)

Break down voltage : 30V

Low leakage current

High reliability

High operating temperature (up to 150 °C)

Compatible with high temperature cycling

during manufacturing operations(exceeding 300 °C)

Compatible with EIA 0101 footprint

Applicable for standard wire bonding

assembly (ball and wedge)