Ultra large band performance to 26 GHz

Resonance free

Phase stability

High rejection at 20 GHz

Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to +30 °C)

o Voltage <0.02/Volt

o Negligible capacitance loss through ageing

Low profile 0.25mm (standard), but lower thickness is possible (i.e 0.10mm) on request

Small size 0.5 x 0.5 mm (0202 format)

 Break down voltage : 30V

Low leakage current < 70pA

High reliability

High operating temperature (up to 150 °C)

Compatible with high temperature cycling

during manufacturing operations (exceeding 300 °C)

Compatible with EIA 0202 footprint

Applicable for standard wire bonding assembly (ball and wedge)