Compatible with MLCC footprint

Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to+150 °C)

o Voltage <0.02/Volt

o Negligible capacitance loss through ageing

Low profile 0.1mm

Small size 0.294 x 0.294 mm (0101+format)

Break down voltage 50V

Low leakage current

High reliability

High operating temperature (up to 150 °C)

Compatible with high temperature cycling during manufacturing operations

(exceeding 300 °C)

Compatible with EIA 0101+ footprint Applicable for standard wire bonding

assembly (ball and wedge)