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DS34T104GN+中文资料
DS34T104GN+数据手册规格书PDF详情
General Description
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.
Features
♦ Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC
♦ Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks
♦ Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS
♦ Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
♦ On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
♦ Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
♦ 64 Independent Bundles/Connections
♦ Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
♦ VLAN Support According to 802.1p and 802.1Q
♦ 10/100 Ethernet MAC Supports MII/RMII/SSMII
♦ Selectable 32-Bit, 16-Bit or SPI Processor Bus
♦ Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
♦ Glueless SDRAM Buffer Management
♦ Low-Power 1.8V Core, 3.3V I/O
Applications
TDM Circuit Extension Over PSN
o Leased-Line Services Over PSN
o TDM Over GPON/EPON
o TDM Over Cable
o TDM Over Wireless
Cellular Backhaul Over PSN
Multiservice Over Unified PSN
HDLC-Based Traffic Transport Over PSN
DS34T104GN+产品属性
- 类型
描述
- 型号
DS34T104GN+
- 功能描述
通信集成电路 - 若干 Quad TDM Over Packet Chip
- RoHS
否
- 制造商
Maxim Integrated
- 类型
Transport Devices
- 封装/箱体
TECSBGA-256
- 数据速率
100 Mbps
- 电源电压-最大
1.89 V, 3.465 V
- 电源电压-最小
1.71 V, 3.135 V
- 电源电流
50 mA, 225 mA
- 最大工作温度
+ 85 C
- 最小工作温度
- 40 C
- 封装
Tube
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
MAXIM |
24+ |
BGA |
23000 |
免费送样原盒原包现货一手渠道联系 |
|||
MAXIM |
2024+ |
N/A |
70000 |
柒号只做原装 现货价秒杀全网 |
|||
MAXIM/美信 |
24+ |
BGA |
337 |
只做原厂渠道 可追溯货源 |
|||
MAXIM |
23+ |
TEBGA |
8888 |
专做原装正品,假一罚百! |
|||
MAXIM |
25+23+ |
BGA484 |
22262 |
绝对原装正品全新进口深圳现货 |
|||
MAXIM |
13+ |
TEBGA |
3738 |
原装分销 |
|||
MAXIM |
25+ |
BGA-484 |
60 |
就找我吧!--邀您体验愉快问购元件! |
|||
MAXIM |
21+ |
BGA |
1372 |
只做原装,绝对现货,原厂代理商渠道,欢迎电话微信查 |
|||
Maxim |
22+ |
484TEBGA |
9000 |
原厂渠道,现货配单 |
|||
MAXIM |
23+ |
BGA |
2567 |
原厂原装正品 |
DS34T104GN+ 价格
参考价格:¥397.8915
DS34T104GN+ 资料下载更多...
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