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DS34T102GN中文资料
DS34T102GN数据手册规格书PDF详情
General Description
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.
Features
♦ Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC
♦ Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks
♦ Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS
♦ Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
♦ On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
♦ Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
♦ 64 Independent Bundles/Connections
♦ Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
♦ VLAN Support According to 802.1p and 802.1Q
♦ 10/100 Ethernet MAC Supports MII/RMII/SSMII
♦ Selectable 32-Bit, 16-Bit or SPI Processor Bus
♦ Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
♦ Glueless SDRAM Buffer Management
♦ Low-Power 1.8V Core, 3.3V I/O
Applications
TDM Circuit Extension Over PSN
o Leased-Line Services Over PSN
o TDM Over GPON/EPON
o TDM Over Cable
o TDM Over Wireless
Cellular Backhaul Over PSN
Multiservice Over Unified PSN
HDLC-Based Traffic Transport Over PSN
DS34T102GN产品属性
- 类型
描述
- 型号
DS34T102GN
- 功能描述
通信集成电路 - 若干 Dual TDM Over Packet Chip
- RoHS
否
- 制造商
Maxim Integrated
- 类型
Transport Devices
- 封装/箱体
TECSBGA-256
- 数据速率
100 Mbps
- 电源电压-最大
1.89 V, 3.465 V
- 电源电压-最小
1.71 V, 3.135 V
- 电源电流
50 mA, 225 mA
- 最大工作温度
+ 85 C
- 最小工作温度
- 40 C
- 封装
Tube
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
MAXIM |
24+ |
BGA484 |
23000 |
免费送样原盒原包现货一手渠道联系 |
|||
MAXIM |
13+ |
TEBGA |
3758 |
原装分销 |
|||
MAXIM |
23+ |
NA |
25060 |
只做进口原装,终端工厂免费送样 |
|||
MAXIM |
23+ |
TEBGA |
8888 |
专做原装正品,假一罚百! |
|||
MAXIM |
20+ |
BGA-484 |
1001 |
就找我吧!--邀您体验愉快问购元件! |
|||
Maxim |
22+ |
484TEBGA |
9000 |
原厂渠道,现货配单 |
|||
Maxim |
21+ |
484TEBGA |
13880 |
公司只售原装,支持实单 |
|||
MAXIM |
23+ |
35500 |
|||||
Maxim Integrated |
24+ |
484-TEBGA(23x23) |
38520 |
一级代理/放心采购 |
|||
MAXIM |
2020+ |
BGA484 |
28 |
百分百原装正品 真实公司现货库存 本公司只做原装 可 |
DS34T102GN 资料下载更多...
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Maxim Integrated Products 美信半导体
Maxim Integrated Products是一家专注于模拟和混合信号集成电路的公司,成立于1983年,总部位于美国加利福尼亚州圣何塞。公司设计和制造广泛应用于电子设备的高性能集成电路,涵盖电源管理、信号处理、传感器和接口等多个领域。 Maxim的产品广泛应用于消费电子、工业、汽车、通信等市场,以其高性能和创新技术著称。公司致力于通过推动技术进步来满足客户的需求,并提供解决方案,帮助客户实现更高的效率和更好的性能。 在2021年,Maxim Integrated被Analog Devices收购,进一步增强了Analog Devices在市场上的竞争力和技术实力。