Surface Mount Ultrafast Plastic Rectifier

Features • Plastic package has Underwriters Laboratories    Flammability Classification 94V-0 • Ideally suited for use in very high frequency switching    power supplies, inverters and as free wheeling diodes • Ultrafast recovery time for high efficiency • For surface mount applications • Gl

Surface Mount Ultrafast Plastic Rectifier

Features • Plastic package has Underwriters Laboratories    Flammability Classification 94V-0 • Ideally suited for use in very high frequency switching    power supplies, inverters and as free wheeling diodes • Ultrafast recovery time for high efficiency • For surface mount applications • Gl

Surface Mount Ultrafast Plastic Rectifier

Features • Plastic package has Underwriters Laboratories    Flammability Classification 94V-0 • Ideally suited for use in very high frequency switching    power supplies, inverters and as free wheeling diodes • Ultrafast recovery time for high efficiency • For surface mount applications • Gl

Surface Mount Ultrafast Plastic Rectifier

Features • Plastic package has Underwriters Laboratories    Flammability Classification 94V-0 • Ideally suited for use in very high frequency switching    power supplies, inverters and as free wheeling diodes • Ultrafast recovery time for high efficiency • For surface mount applications • Gl

封装/外壳：DO-214AA，SMB 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：DIODE GP 200V 1A DO214AA 分立半导体产品 二极管 - 整流器 - 单

封装/外壳：DO-214AA，SMB 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：DIODE GEN PURP 200V 2A DO214AA 分立半导体产品 二极管 - 整流器 - 单

Surface-Mount Schottky Barrier Rectifier

FEATURES • Low profile package • Ideal for automated placement • Guardring for overvoltage protection • Low power losses, high efficiency • Low forward voltage drop • High surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material categorization: for definit

Surface Mount Schottky Barrier Rectifier

FEATURES • Low profile package • Ideal for automated placement • Guardring for overvoltage protection • Low power losses, high efficiency • Low forward voltage drop • High surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material categorization: For definiti

Low forward voltage drop

FEATURES • Glass passivated chip junction • Ultrafast reverse recovery time • Low forward voltage drop • Low leakage current • Low switching losses, high efficiency • High forward surge capability • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC T

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The st

IRFR120

DESCRIPTION Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The st