封装/外壳：18-SOIC（0.295"，7.50mm 宽） 功能：DTMF 接收器 包装：托盘 描述：IC TELECOM INTERFACE 18SOIC 集成电路（IC） 电信

封装/外壳：18-SOIC（0.295"，7.50mm 宽） 功能：DTMF 接收器 包装：托盘 描述：IC TELECOM INTERFACE 18SOIC 集成电路（IC） 电信

CMOS Integrated DTMF Receiver

Product Description The CAMD CM8870/70C provides full DTMF receiver capability by integrating both the bandsplit filter and digital decoder functions into a single 18-pin DIP, SOIC, or 20-pin PLCC package. The CM8870/70C is manufactured using state-of-the-art CMOS process technology for low pow

CMOS Integrated DTMF Receiver

Product Description The CAMD CM8870/70C provides full DTMF receiver capability by integrating both the bandsplit filter and digital decoder functions into a single 18-pin DIP, SOIC, or 20-pin PLCC package. The CM8870/70C is manufactured using state-of-the-art CMOS process technology for low pow

CMOS Integrated DTMF Receiver

Product Description The CAMD CM8870/70C provides full DTMF receiver capability by integrating both the bandsplit filter and digital decoder functions into a single 18-pin DIP, SOIC, or 20-pin PLCC package. The CM8870/70C is manufactured using state-of-the-art CMOS process technology for low pow

CMOS Integrated DTMF Receiver

Product Description The CAMD CM8870/70C provides full DTMF receiver capability by integrating both the bandsplit filter and digital decoder functions into a single 18-pin DIP, SOIC, or 20-pin PLCC package. The CM8870/70C is manufactured using state-of-the-art CMOS process technology for low pow

DTMF Receiver

Description The M-8870 is a full DTMF Receiver that integrates both bandsplit filter and decoder functions into a single 18-pin DIP or SOIC package. Manufactured using CMOS process technology, the M-8870 offers low power consumption (35 mW max) and precise data handling. Features • Low Power Co