封装/外壳：473-LFBGA 包装：托盘 描述：IC MPU MPC83XX 266MHZ 473MAPBGA 集成电路（IC） 微处理器

PowerQUICC, Power Architecture SoC 266MHz, DDR2, PCIe, GbE, USB, -40 to 105C, Rev 1.0

MPC8308 PowerQUICC II Pro Processor Hardware Specification

封装/外壳：473-LFBGA 包装：管件 描述：IC MPU MPC83XX 266MHZ 473MAPBGA 集成电路（IC） 微处理器

MPC8308 PowerQUICC II Pro Processor Hardware Specification

文件：672.54 Kbytes Page：88 Pages

MPC8308 PowerQUICC II Pro Processor Hardware Specification

文件：2.5564 Mbytes Page：88 Pages

PowerQUICC, Power Architecture SoC 266MHz, DDR2, PCIe, GbE, USB, -40 to 105C, Rev 1.1

Connector Modules with Intergrated LAN Magnetics

[FILTRAN] • Unique layout conserves precious circuit board space • Designed for HUB applications • IEEE 802.3u • Compliant with a wide assortment of ICs • Primary center taps available for additional EMI reduction

RJ-45 Connector Modules with Intergrated LAN Magnetics

• Unique layout conserves precious circuit board space • Designed for HUB applications • IEEE 802.3u • Compliant with a wide assortment of ICs • Primary center taps available for additional EMI reduction

RS-232, Low Cap, #22-8pr, SR-PVC, O/A FoilBraid, PVC Jkt, CMG

Product Description Computer EIA RS-232 Cable, 22 AWG stranded (7x30) tinned copper conductors, semi-rigid PVC insulation, 8 twisted pairs, overall Beldfoil® (100 coverage) tinned copper braid shield (65 coverage), PVC jacket.

Wire-Thread-Inserts

文件：102.37 Kbytes Page：3 Pages

Connector Modules with Intergrated LAN Magnetics

文件：717.17 Kbytes Page：1 Pages