Hardware Specifications

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SDRAM/DDR Memory Controller

Key features are shown below. • MPC603e series e300 core – Superscalar architecture – 760 MIPS at 400 MHz (–40 oC to +85 oC) – 16 KB Instruction cache, 16 KB Data cache – Double precision FPU – Instruction and Data MMU – Standard and Critical interrupt capability •

Technical Data

Key features are shown below. • MPC603e series e300 core – Superscalar architecture – 760 MIPS at 400 MHz (–40 oC to +85 oC) – 16 KB Instruction cache, 16 KB Data cache – Double precision FPU – Instruction and Data MMU – Standard and Critical interrupt capability •

SDRAM/DDR Memory Controller

Key features are shown below. • MPC603e series e300 core – Superscalar architecture – 760 MIPS at 400 MHz (–40 oC to +85 oC) – 16 KB Instruction cache, 16 KB Data cache – Double precision FPU – Instruction and Data MMU – Standard and Critical interrupt capability •

Technical Data

Key features are shown below. • MPC603e series e300 core – Superscalar architecture – 760 MIPS at 400 MHz (–40 oC to +85 oC) – 16 KB Instruction cache, 16 KB Data cache – Double precision FPU – Instruction and Data MMU – Standard and Critical interrupt capability •

MPC5200 Microprocessor Technical Summary

Technical Data

Key features are shown below. • MPC603e series e300 core – Superscalar architecture – 760 MIPS at 400 MHz (–40 oC to +85 oC) – 16 KB Instruction cache, 16 KB Data cache – Double precision FPU – Instruction and Data MMU – Standard and Critical interrupt capability •

SDRAM/DDR Memory Controller

Key features are shown below. • MPC603e series e300 core – Superscalar architecture – 760 MIPS at 400 MHz (–40 oC to +85 oC) – 16 KB Instruction cache, 16 KB Data cache – Double precision FPU – Instruction and Data MMU – Standard and Critical interrupt capability •

SDRAM/DDR Memory Controller

文件：984.14 Kbytes Page：72 Pages

SDRAM / DDR Memory Controller

文件：977.14 Kbytes Page：72 Pages

SDRAM / DDR Memory Controller

文件：977.14 Kbytes Page：72 Pages

SDRAM/DDR Memory Controller

文件：984.14 Kbytes Page：72 Pages

Hardware Specifications

文件：1.40462 Mbytes Page：76 Pages

Hardware Specifications

文件：6.73401 Mbytes Page：80 Pages

Hardware Specifications

文件：1.40462 Mbytes Page：76 Pages

Hardware Specifications

文件：6.73401 Mbytes Page：80 Pages

封装/外壳：272-BBGA 包装：卷带（TR） 描述：IC MPU MPC52XX 266MHZ 272BGA 集成电路（IC） 微处理器

MPC5200 FGDS

封装/外壳：272-BBGA 包装：托盘 描述：IC MPU MPC52XX 400MHZ 272BGA 集成电路（IC） 微处理器

Hardware Specifications

文件：1.40462 Mbytes Page：76 Pages

Hardware Specifications

文件：6.73401 Mbytes Page：80 Pages

LEAD-FREE INDUSTRIAL-QUAL 5200 400MHZ RS

HABANERO INDUS - PBFREE

SDRAM/DDR Memory Controller

文件：984.14 Kbytes Page：72 Pages

Hardware Specifications

文件：1.40462 Mbytes Page：76 Pages

SDRAM/DDR Memory Controller

文件：984.14 Kbytes Page：72 Pages

Silicon planar type

Silicon planar type For stabilization of power supply ■ Features • Mini power type package (2-pin) • Allowing automatic mounting with the emboss taping • Sharp rising performance

RF dual gain-stage

DESCRIPTION The SA5200 is a dual amplifier with DC to 1200MHz response. Low noise (NF = 3.6dB) makes this part ideal for RF front-ends, and a simple power-down mode saves current for battery operated equipment. Inputs and outputs are matched to 50Ω. The enable pin allows the designer the abilit

High Speed IR Emitting Diode in ø5 mm (T–13/4) Package

DESCRIPTION TSFF5210 is an infrared, 870 nm emitting diode in GaAlAs double hetero (DH) technology with high radiant power and high speed, molded in a clear, untinted plastic package. FEATURES • Package type: leaded • Package form: T-1 3/4 • Dimensions (in mm): Ø 5 • Leads with stand-off •

1.55 關m Laser-Diode DIP Module

文件：44.53 Kbytes Page：3 Pages

High Efficiency LED, 5 mm Tinted Non-Diffused Package

文件：130.169 Kbytes Page：9 Pages