| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
PGAZIFTest&Burn-inSocketforAnyFootprintonStd8x8to21x21Grid FEATURES •StrongMetalCamActivatesNormally-closedContacts,PreventingDependencyonPlasticfor ContactForce •HandlemountedonRight-orLeft-handSide •AnyFootprintAcceptedonStandard13x13to21x21Grid GENERALSPECIFICATIONS •SOCKETBODY:blackUL94V-0PolyphenyleneSulfid | ARIES Aries Electronics,inc |  |   | |
32-bitARM7TDMIRISCstaticCMOSCPUcore OVERVIEW TheHMS30C7202isahighlyintegratedlowpowermicroprocessorforpersonaldigitalassistants,andotherapplicationsdescribedbelow.ThedeviceincorporatesanARM720TCPUandsysteminterfacelogictointerfacewithvarioustypesofdevices.HMS30C7202isahighlymodulardesignbase | HynixHynix Semiconductor SK海力士海力士半导体 |  | | |
MAGNETIC-LATCHINGDPDTHALF-SIZECRYSTALCANMILITARYRELAY 文件：1.11117 Mbytes Page：3 Pages | TELEDYNE TELEDYNE |  | | |
3M??Scotch짰PrintableFlatbackPaperTape256 文件：564.56 Kbytes Page：5 Pages | 3MMinnesota Mining and Manufacturing 明尼苏达矿务明尼苏达矿务及制造业公司 |  | | |
256b/257bTranscodingfor100Gb/sBackplaneandCopperCable 文件：343.53 Kbytes Page：21 Pages | IBM IBM Microelectronics |  | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
INTEL |
2019 |
BGA |
55000 |
真实现货库存 |
|||
CY |
01+ |
SSOP-48 |
6000 |
绝对原装自己现货 |
|||
256KX9 |
1 |
1 |
|||||
INTEL/英特尔 |
22+ |
BGA79 |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
22+ |
DIP16 |
3629 |
原装优势!房间现货!欢迎来电! |
||||
INTEL/英特尔 |
21+ |
BGA |
6880 |
只做原装 |
|||
INTEL |
23+ |
BGA79 |
5000 |
专注配单,只做原装进口现货 |
|||
intel |
2138+ |
BGA |
8960 |
专营BGA,QFP原装现货,假一赔十 |
|||
SEC |
06+07+ |
DIP16 |
50 |
||||
INTEL/英特尔 |
23+ |
BGA |
96880 |
只做原装,欢迎来电资询 |
MOCD256VM芯片相关品牌
MOCD256VM规格书下载地址
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2019-3-5
DdatasheetPDF页码索引
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