MH32价格

参考价格:¥0.1091

型号:MH3261-151Y 品牌:Bourns 备注:这里有MH32多少钱,2025年最近7天走势,今日出价,今日竞价,MH32批发/采购报价,MH32行情走势销售排行榜,MH32报价。
型号 功能描述 生产厂家 企业 LOGO 操作
MH32

HIGH EFFICIENCY RECTIFIERS(3.0A,50-400V)

MOSPEC

统懋

MH32

MH45/MH32/MH20 Series High Current Chip Ferrite Beads

Features High resistance to heat and humidity Resistance to mechanical shock and pressure Accurate dimensions for automatic surface mounting Wide impedance range RoHS compliant* and halogen free Applications Power supply lines IC power lines Signal lines

Bourns

伯恩斯

MH32

高效率整流管

MOSPEC

统懋

MH45/MH32/MH20 Series High Current Chip Ferrite Beads

Features High resistance to heat and humidity Resistance to mechanical shock and pressure Accurate dimensions for automatic surface mounting Wide impedance range RoHS compliant* and halogen free Applications Power supply lines IC power lines Signal lines

Bourns

伯恩斯

2,147,483,684-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D64AKQJ is 33554432 - word x 64-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 8 industry standard 16M x 16 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m

Mitsubishi

三菱电机

2,147,483,684-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D64AKQJ is 33554432 - word x 64-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 8 industry standard 16M x 16 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m

Mitsubishi

三菱电机

2,147,483,648-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D64KQH is 33554432 - word x 64-bit Double Data Rate(DDR) Synchronous DRAM mounted module. This consists of 8 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-type memory module i

Mitsubishi

三菱电机

2,147,483,648-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D64KQH is 33554432 - word x 64-bit Double Data Rate(DDR) Synchronous DRAM mounted module. This consists of 8 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-type memory module i

Mitsubishi

三菱电机

2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D72AKLA is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 32M x 4 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m

Mitsubishi

三菱电机

2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D72AKLA is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 32M x 4 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m

Mitsubishi

三菱电机

2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D72AKLB is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 16M x 8 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m

Mitsubishi

三菱电机

2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D72AKLB is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 16M x 8 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m

Mitsubishi

三菱电机

2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D72KLH is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 9 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-ty pe memory module

Mitsubishi

三菱电机

2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH32D72KLH is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 9 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-ty pe memory module

Mitsubishi

三菱电机

2,147,483,648-BIT (33,554,432 - WORD BY 64-BIT)Synchronous DRAM

DESCRIPTION The MH32S64APHB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den

Mitsubishi

三菱电机

2,147,483,648-BIT (33,554,432 - WORD BY 64-BIT)Synchronous DRAM

DESCRIPTION The MH32S64APHB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den

Mitsubishi

三菱电机

2,147,483,648-BIT (33,554,432 - WORD BY 64-BIT)Synchronous DRAM

DESCRIPTION The MH32S64APHB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den

Mitsubishi

三菱电机

2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

Mitsubishi

三菱电机

2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

Mitsubishi

三菱电机

2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

Mitsubishi

三菱电机

2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

Mitsubishi

三菱电机

214683648-BIT (3354432- WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH32S64PHB is 3354432 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densitie

Mitsubishi

三菱电机

2,147,483,648-BIT ( 33,554,432-WORD BY 64-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S64PHB is 33554432 - word x 64-bit Synchronous DRAM module. This consist of sixteen industry standard 16M x 8 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. Th

Mitsubishi

三菱电机

214683648-BIT (3354432- WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH32S64PHB is 3354432 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densitie

Mitsubishi

三菱电机

214683648-BIT (3354432- WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH32S64PHB is 3354432 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densitie

Mitsubishi

三菱电机

2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM

DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high de

Mitsubishi

三菱电机

2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM

DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high de

Mitsubishi

三菱电机

2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM

DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high de

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72AQJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72AQJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72AVJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a

Mitsubishi

三菱电机

2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM

DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72PHB is 33554432 - word x 72-bit Synchronous DRAM module. This consist of eighteen industry standard 16M x 8 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. T

Mitsubishi

三菱电机

2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM

DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den

Mitsubishi

三菱电机

2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM

DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den

Mitsubishi

三菱电机

2415919104-BIT ( 33554432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72QJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required.

Mitsubishi

三菱电机

2415919104-BIT ( 33554432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72QJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required.

Mitsubishi

三菱电机

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH32S72VJA is 33554432 - word x 72-bit Synchronous DRAM module. This consist of eighteen industry standard 32M x 4 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. T

Mitsubishi

三菱电机

HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM

DESCRIPTION The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The stacked structure of TSOP on a card edge dual in-line package provides any

Mitsubishi

三菱电机

HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM

DESCRIPTION The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The stacked structure of TSOP on a card edge dual in-line package provides any

Mitsubishi

三菱电机

HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM

DESCRIPTION The MH32V725BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The mounting of TSOP on a card edge dual in-line package provides any applicatio

Mitsubishi

三菱电机

HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM

DESCRIPTION The MH32V725BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The mounting of TSOP on a card edge dual in-line package provides any applicatio

Mitsubishi

三菱电机

Ferrite Chip Bead Series

文件:214.73 Kbytes Page:1 Pages

Bourns

伯恩斯

High Current Chip Ferrite Beads

文件:1.29617 Mbytes Page:8 Pages

Bourns

伯恩斯

High Current Chip Ferrite Beads

文件:1.29617 Mbytes Page:8 Pages

Bourns

伯恩斯

封装/外壳:1210(3225 公制) 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:FERRITE BEAD 200 OHM 1210 1LN 滤波器 铁氧体磁珠和芯片

ETC

知名厂家

封装/外壳:1210(3225 公制) 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:FERRITE BEAD 30 OHM 1210 1LN 滤波器 铁氧体磁珠和芯片

ETC

知名厂家

High Current Chip Ferrite Beads

文件:1.29617 Mbytes Page:8 Pages

Bourns

伯恩斯

High Current Chip Ferrite Beads

文件:1.29617 Mbytes Page:8 Pages

Bourns

伯恩斯

High Current Chip Ferrite Beads

文件:1.29617 Mbytes Page:8 Pages

Bourns

伯恩斯

High Current Chip Ferrite Beads

文件:1.29617 Mbytes Page:8 Pages

Bourns

伯恩斯

Wide Input, 3W Ultra-Miniature DC/DC Converters

文件:403.42 Kbytes Page:2 Pages

MPD

Wide Input, 3W Ultra-Miniature DC/DC Converters

文件:403.42 Kbytes Page:2 Pages

MPD

Wide Input, 3W Ultra-Miniature DC/DC Converters

MPD

MH32产品属性

  • 类型

    描述

  • 型号

    MH32

  • 制造商

    Square D by Schneider Electric

  • 功能描述

    PANELBOARD ENCLOSURE/BOX TYPE 1 32H 20W

更新时间:2025-10-1 20:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
HITACHI/日立
25+
QFP
65428
百分百原装现货 实单必成
MITSUBIS
20+
QFP
500
样品可出,优势库存欢迎实单
Bourns(伯恩斯)
24+
标准封装
9663
我们只是原厂的搬运工
BOUR
23+
NA
3486
专做原装正品,假一罚百!
MITSUBISH
25+23+
QFP
39320
绝对原装正品全新进口深圳现货
MITSUBIS
22+
TQFP
3000
原装正品,支持实单
HIT
25+
QFP
4500
全新原装、诚信经营、公司现货销售!
MISUBISHI
24+
QFP
3520
只做原厂渠道 可追溯货源
MITSUBIS
23+
PLCC
7000
绝对全新原装!100%保质量特价!请放心订购!
1000
公司优势库存 热卖中!

MH32数据表相关新闻