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参考价格：￥0.1091

型号：MH3261-151Y 品牌：Bourns 备注：这里有MH32多少钱，2025年最近7天走势，今日出价，今日竞价，MH32批发/采购报价，MH32行情走势销售排行榜，MH32报价。

型号	功能描述	生产厂家&企业	LOGO
MH32	HIGH EFFICIENCY RECTIFIERS(3.0A,50-400V)	MOSPEC 统懋	MOSPEC
MH32	MH45/MH32/MH20 Series High Current Chip Ferrite Beads Features High resistance to heat and humidity Resistance to mechanical shock and pressure Accurate dimensions for automatic surface mounting Wide impedance range RoHS compliant* and halogen free Applications Power supply lines IC power lines Signal lines	Bourns 伯恩斯	Bourns
MH3261-601Y	MH45/MH32/MH20 Series High Current Chip Ferrite Beads Features High resistance to heat and humidity Resistance to mechanical shock and pressure Accurate dimensions for automatic surface mounting Wide impedance range RoHS compliant* and halogen free Applications Power supply lines IC power lines Signal lines	Bourns 伯恩斯	Bourns
MH32D64AKQJ-10	2,147,483,684-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D64AKQJ is 33554432 - word x 64-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 8 industry standard 16M x 16 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D64AKQJ-75	2,147,483,684-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D64AKQJ is 33554432 - word x 64-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 8 industry standard 16M x 16 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D64KQH-10	2,147,483,648-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D64KQH is 33554432 - word x 64-bit Double Data Rate(DDR) Synchronous DRAM mounted module. This consists of 8 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-type memory module i	Mitsubishi 三菱电机	Mitsubishi
MH32D64KQH-75	2,147,483,648-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D64KQH is 33554432 - word x 64-bit Double Data Rate(DDR) Synchronous DRAM mounted module. This consists of 8 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-type memory module i	Mitsubishi 三菱电机	Mitsubishi
MH32D72AKLA-10	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72AKLA is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 32M x 4 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D72AKLA-75	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72AKLA is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 32M x 4 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D72AKLB-10	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72AKLB is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 16M x 8 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D72AKLB-75	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72AKLB is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 16M x 8 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D72KLH-10	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72KLH is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 9 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-ty pe memory module	Mitsubishi 三菱电机	Mitsubishi
MH32D72KLH-75	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72KLH is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 9 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-ty pe memory module	Mitsubishi 三菱电机	Mitsubishi
MH32S64APHB-6	2,147,483,648-BIT (33,554,432 - WORD BY 64-BIT)Synchronous DRAM DESCRIPTION The MH32S64APHB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S64APHB-7	2,147,483,648-BIT (33,554,432 - WORD BY 64-BIT)Synchronous DRAM DESCRIPTION The MH32S64APHB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S64APHB-8	2,147,483,648-BIT (33,554,432 - WORD BY 64-BIT)Synchronous DRAM DESCRIPTION The MH32S64APHB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S64PFJ-6	2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi	Mitsubishi 三菱电机	Mitsubishi
MH32S64PFJ-6L	2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi	Mitsubishi 三菱电机	Mitsubishi
MH32S64PFJ-7	2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi	Mitsubishi 三菱电机	Mitsubishi
MH32S64PFJ-7L	2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi	Mitsubishi 三菱电机	Mitsubishi
MH32S64PHB-10	214683648-BIT (3354432- WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PHB is 3354432 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densitie	Mitsubishi 三菱电机	Mitsubishi
MH32S64PHB-6	2,147,483,648-BIT ( 33,554,432-WORD BY 64-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S64PHB is 33554432 - word x 64-bit Synchronous DRAM module. This consist of sixteen industry standard 16M x 8 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. Th	Mitsubishi 三菱电机	Mitsubishi
MH32S64PHB-7	214683648-BIT (3354432- WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PHB is 3354432 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densitie	Mitsubishi 三菱电机	Mitsubishi
MH32S64PHB-8	214683648-BIT (3354432- WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PHB is 3354432 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densitie	Mitsubishi 三菱电机	Mitsubishi
MH32S72APHB-6	2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high de	Mitsubishi 三菱电机	Mitsubishi
MH32S72APHB-7	2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high de	Mitsubishi 三菱电机	Mitsubishi
MH32S72APHB-8	2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high de	Mitsubishi 三菱电机	Mitsubishi
MH32S72AQJA-7	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72AQJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required	Mitsubishi 三菱电机	Mitsubishi
MH32S72AQJA-8	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72AQJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required	Mitsubishi 三菱电机	Mitsubishi
MH32S72AVJA-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72AVJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required	Mitsubishi 三菱电机	Mitsubishi
MH32S72BBFA-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72BBFA-7	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72BBFA-8	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72DBFA-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72DBFA-7	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72DBFA-8	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72PHB-10	2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S72PHB-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72PHB is 33554432 - word x 72-bit Synchronous DRAM module. This consist of eighteen industry standard 16M x 8 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. T	Mitsubishi 三菱电机	Mitsubishi
MH32S72PHB-7	2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S72PHB-8	2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S72QJA-7	2415919104-BIT ( 33554432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72QJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required.	Mitsubishi 三菱电机	Mitsubishi
MH32S72QJA-8	2415919104-BIT ( 33554432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72QJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required.	Mitsubishi 三菱电机	Mitsubishi
MH32S72VJA-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72VJA is 33554432 - word x 72-bit Synchronous DRAM module. This consist of eighteen industry standard 32M x 4 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. T	Mitsubishi 三菱电机	Mitsubishi
MH32V7245BST-5	HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM DESCRIPTION The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The stacked structure of TSOP on a card edge dual in-line package provides any	Mitsubishi 三菱电机	Mitsubishi
MH32V7245BST-6	HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM DESCRIPTION The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The stacked structure of TSOP on a card edge dual in-line package provides any	Mitsubishi 三菱电机	Mitsubishi
MH32V725BST-5	HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM DESCRIPTION The MH32V725BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The mounting of TSOP on a card edge dual in-line package provides any applicatio	Mitsubishi 三菱电机	Mitsubishi
MH32V725BST-6	HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM DESCRIPTION The MH32V725BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The mounting of TSOP on a card edge dual in-line package provides any applicatio	Mitsubishi 三菱电机	Mitsubishi
MH3225_MDS	Ferrite Chip Bead Series 文件：214.73 Kbytes Page：1 Pages	Bourns 伯恩斯	Bourns
MH3225-151Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-201Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-201Y	封装/外壳：1210（3225 公制）包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带描述：FERRITE BEAD 200 OHM 1210 1LN 滤波器铁氧体磁珠和芯片	ETC 知名厂家	ETC
MH3225-300Y	封装/外壳：1210（3225 公制）包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带描述：FERRITE BEAD 30 OHM 1210 1LN 滤波器铁氧体磁珠和芯片	ETC 知名厂家	ETC
MH3225-300Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-520Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-650Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-900Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH324D-05RW	Wide Input, 3W Ultra-Miniature DC/DC Converters 文件：403.42 Kbytes Page：2 Pages	MPD MPD (Memory Protection Devices)	MPD
MH324D-12RW	Wide Input, 3W Ultra-Miniature DC/DC Converters 文件：403.42 Kbytes Page：2 Pages	MPD MPD (Memory Protection Devices)	MPD
MH324D-15RW	Wide Input, 3W Ultra-Miniature DC/DC Converters 文件：403.42 Kbytes Page：2 Pages	MPD MPD (Memory Protection Devices)	MPD
MH324S-03RW	Wide Input, 3W Ultra-Miniature DC/DC Converters 文件：403.42 Kbytes Page：2 Pages	MPD MPD (Memory Protection Devices)	MPD

MH32产品属性

类型
描述
型号
MH32
制造商
Square D by Schneider Electric
功能描述
PANELBOARD ENCLOSURE/BOX TYPE 1 32H 20W

MH32供应商更多...

更新时间：2025-8-10 1:37:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市英卓尔科技有限公司	MH3294F16	MITSUBIS	20+	QFP	500	样品可出,优势库存欢迎实单	询价
深圳市高捷芯城科技有限公司	MH3261-601Y	Bourns(伯恩斯)	24+	1206	60545	免费送样,账期支持,原厂直供,没有中间商赚差价	询价
深圳市凌旭科技有限公司	MH3261-601Y	BOURNS	2016+	SMD	3000	只做原装,假一罚十,公司可开17%增值税发票!	询价
上海意淼电子科技有限公司	MH3268CP10	MITSUBISHI	23+	PLCC	20000	全新原装假一赔十	询价
深圳市明嘉莱科技有限公司	MH3261-601Y	BOURNS/伯恩斯	25+	SMD	156043	明嘉莱只做原装正品现货	询价
深圳市科芯源微电子有限公司	MH3292C14F16IDJ78	HITACHI/日立	25+	QFP	65428	百分百原装现货实单必成	询价
深圳市佳鑫美电子科技有限公司	MH32M16E056A		24+	SOP40	3629	原装优势!房间现货!欢迎来电!	询价
深圳市威雅利发展有限公司	MH3216HM501NT	TAIYO	13+	SMD	2000	一级代理,专注军工、汽车、医疗、工业、新能源、电力	询价
深圳市创新迹电子有限公司	MH3261-500Y	BOURNS/伯恩斯	2021	SMD3261	66730	现货库存一站式配套元器件	询价
深圳市得捷芯城科技有限公司	MH3261-601Y	Bourns(伯恩斯)	24+	标准封装	9663	我们只是原厂的搬运工	询价

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MH310原厂原装，现货价优
MH310原厂原装，现货价优
2024-8-13
MGSF1N03LT1G
进口代理
2022-9-8
MHW820-2全新原装现货
可立即发货
2019-9-24
MGSF1N02LT1GON30V，2.1A，N沟道SOT-23产品大量库存
MGSF1N02LT1GON30V，2.1A，N沟道SOT-23产品大量库存
2019-3-29
MHCI04015-100M
MHCI04015-100M，全新原装当天发货或门市自取0755-82732291.
2019-3-28

DdatasheetPDF页码索引

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DdatasheetPDF页码索引