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MH32价格

参考价格：￥0.1091

型号：MH3261-151Y 品牌：Bourns 备注：这里有MH32多少钱，2025年最近7天走势，今日出价，今日竞价，MH32批发/采购报价，MH32行情走势销售排行榜，MH32报价。

型号	功能描述	生产厂家企业	LOGO
MH32	HIGH EFFICIENCY RECTIFIERS(3.0A,50-400V)	MOSPEC 统懋	MOSPEC
MH32	MH45/MH32/MH20 Series High Current Chip Ferrite Beads Features High resistance to heat and humidity Resistance to mechanical shock and pressure Accurate dimensions for automatic surface mounting Wide impedance range RoHS compliant* and halogen free Applications Power supply lines IC power lines Signal lines	Bourns 伯恩斯	Bourns
MH32	高效率整流管	MOSPEC 统懋	MOSPEC
MH3261-601Y	MH45/MH32/MH20 Series High Current Chip Ferrite Beads Features High resistance to heat and humidity Resistance to mechanical shock and pressure Accurate dimensions for automatic surface mounting Wide impedance range RoHS compliant* and halogen free Applications Power supply lines IC power lines Signal lines	Bourns 伯恩斯	Bourns
MH32D64AKQJ-10	2,147,483,684-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D64AKQJ is 33554432 - word x 64-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 8 industry standard 16M x 16 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D64AKQJ-75	2,147,483,684-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D64AKQJ is 33554432 - word x 64-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 8 industry standard 16M x 16 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D64KQH-10	2,147,483,648-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D64KQH is 33554432 - word x 64-bit Double Data Rate(DDR) Synchronous DRAM mounted module. This consists of 8 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-type memory module i	Mitsubishi 三菱电机	Mitsubishi
MH32D64KQH-75	2,147,483,648-BIT (33,554,432-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D64KQH is 33554432 - word x 64-bit Double Data Rate(DDR) Synchronous DRAM mounted module. This consists of 8 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-type memory module i	Mitsubishi 三菱电机	Mitsubishi
MH32D72AKLA-10	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72AKLA is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 32M x 4 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D72AKLA-75	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72AKLA is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 32M x 4 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D72AKLB-10	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72AKLB is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 16M x 8 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D72AKLB-75	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72AKLB is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 18 industry standard 16M x 8 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory m	Mitsubishi 三菱电机	Mitsubishi
MH32D72KLH-10	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72KLH is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 9 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-ty pe memory module	Mitsubishi 三菱电机	Mitsubishi
MH32D72KLH-75	2,415,919,104-BIT (33,554,432-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module DESCRIPTION The MH32D72KLH is 33554432 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 9 industry standard 32M x 8 DDR Synchronous DRAMs in TSOP with SSTL_2 interf ace which achieves very high speed data rate up to 133MHz. This socket-ty pe memory module	Mitsubishi 三菱电机	Mitsubishi
MH32S64APHB-6	2,147,483,648-BIT (33,554,432 - WORD BY 64-BIT)Synchronous DRAM DESCRIPTION The MH32S64APHB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S64APHB-7	2,147,483,648-BIT (33,554,432 - WORD BY 64-BIT)Synchronous DRAM DESCRIPTION The MH32S64APHB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S64APHB-8	2,147,483,648-BIT (33,554,432 - WORD BY 64-BIT)Synchronous DRAM DESCRIPTION The MH32S64APHB is 33554432 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S64PFJ-6	2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi	Mitsubishi 三菱电机	Mitsubishi
MH32S64PFJ-6L	2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi	Mitsubishi 三菱电机	Mitsubishi
MH32S64PFJ-7	2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi	Mitsubishi 三菱电机	Mitsubishi
MH32S64PFJ-7L	2147483648-BIT (33554432 - WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PFJ is 33554432 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi	Mitsubishi 三菱电机	Mitsubishi
MH32S64PHB-10	214683648-BIT (3354432- WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PHB is 3354432 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densitie	Mitsubishi 三菱电机	Mitsubishi
MH32S64PHB-6	2,147,483,648-BIT ( 33,554,432-WORD BY 64-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S64PHB is 33554432 - word x 64-bit Synchronous DRAM module. This consist of sixteen industry standard 16M x 8 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. Th	Mitsubishi 三菱电机	Mitsubishi
MH32S64PHB-7	214683648-BIT (3354432- WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PHB is 3354432 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densitie	Mitsubishi 三菱电机	Mitsubishi
MH32S64PHB-8	214683648-BIT (3354432- WORD BY 64-BIT)SynchronousDRAM DESCRIPTION The MH32S64PHB is 3354432 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densitie	Mitsubishi 三菱电机	Mitsubishi
MH32S72APHB-6	2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high de	Mitsubishi 三菱电机	Mitsubishi
MH32S72APHB-7	2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high de	Mitsubishi 三菱电机	Mitsubishi
MH32S72APHB-8	2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM DESCRIPTION The MH32S72APHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high de	Mitsubishi 三菱电机	Mitsubishi
MH32S72AQJA-7	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72AQJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required	Mitsubishi 三菱电机	Mitsubishi
MH32S72AQJA-8	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72AQJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required	Mitsubishi 三菱电机	Mitsubishi
MH32S72AVJA-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72AVJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required	Mitsubishi 三菱电机	Mitsubishi
MH32S72BBFA-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72BBFA-7	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72BBFA-8	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72DBFA-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72DBFA-7	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72DBFA-8	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a	Mitsubishi 三菱电机	Mitsubishi
MH32S72PHB-10	2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S72PHB-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72PHB is 33554432 - word x 72-bit Synchronous DRAM module. This consist of eighteen industry standard 16M x 8 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. T	Mitsubishi 三菱电机	Mitsubishi
MH32S72PHB-7	2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S72PHB-8	2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den	Mitsubishi 三菱电机	Mitsubishi
MH32S72QJA-7	2415919104-BIT ( 33554432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72QJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required.	Mitsubishi 三菱电机	Mitsubishi
MH32S72QJA-8	2415919104-BIT ( 33554432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72QJA is 33554432 - word x 72-bit Sy nchronous DRAM module. This consist of eighteen industry standard 32M x 4 Sy nchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package prov ides any application where high densities and large of quantities memory are required.	Mitsubishi 三菱电机	Mitsubishi
MH32S72VJA-6	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72VJA is 33554432 - word x 72-bit Synchronous DRAM module. This consist of eighteen industry standard 32M x 4 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. T	Mitsubishi 三菱电机	Mitsubishi
MH32V7245BST-5	HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM DESCRIPTION The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The stacked structure of TSOP on a card edge dual in-line package provides any	Mitsubishi 三菱电机	Mitsubishi
MH32V7245BST-6	HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM DESCRIPTION The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The stacked structure of TSOP on a card edge dual in-line package provides any	Mitsubishi 三菱电机	Mitsubishi
MH32V725BST-5	HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM DESCRIPTION The MH32V725BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The mounting of TSOP on a card edge dual in-line package provides any applicatio	Mitsubishi 三菱电机	Mitsubishi
MH32V725BST-6	HYPER PAGE MODE 2415919104 - BIT ( 33554432 - WORD BY 72 - BIT ) DYNAMIC RAM DESCRIPTION The MH32V725BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP. The mounting of TSOP on a card edge dual in-line package provides any applicatio	Mitsubishi 三菱电机	Mitsubishi
MH3225_MDS	Ferrite Chip Bead Series 文件：214.73 Kbytes Page：1 Pages	Bourns 伯恩斯	Bourns
MH3225-151Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-201Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-201Y	封装/外壳：1210（3225 公制）包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带描述：FERRITE BEAD 200 OHM 1210 1LN 滤波器铁氧体磁珠和芯片	ETC 知名厂家	ETC
MH3225-300Y	封装/外壳：1210（3225 公制）包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带描述：FERRITE BEAD 30 OHM 1210 1LN 滤波器铁氧体磁珠和芯片	ETC 知名厂家	ETC
MH3225-300Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-520Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-650Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH3225-900Y	High Current Chip Ferrite Beads 文件：1.29617 Mbytes Page：8 Pages	Bourns 伯恩斯	Bourns
MH324D-05RW	Wide Input, 3W Ultra-Miniature DC/DC Converters 文件：403.42 Kbytes Page：2 Pages	MPD	MPD
MH324D-05RW	Wide Input, 3W Ultra-Miniature DC/DC Converters	MPD	MPD
MH324D-12RW	Wide Input, 3W Ultra-Miniature DC/DC Converters	MPD	MPD

MH32产品属性

类型
描述
型号
MH32
制造商
Square D by Schneider Electric
功能描述
PANELBOARD ENCLOSURE/BOX TYPE 1 32H 20W

MH32供应商更多...

更新时间：2025-11-22 11:55:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市华斯顿科技有限公司	MH3292F16	MITSUBISH	25+23+	QFP	39320	绝对原装正品全新进口深圳现货	询价
上海鑫科润电子科技有限公司	MH3296A28F16JE-4809	HIT	02+	QFP	181	原装现货海量库存欢迎咨询	询价
深圳市宇创芯科技有限公司	MH3258F10V137C(HD6433258	HITACHI/日立	24+	QFP	9600	原装现货,优势供应,支持实单!	询价
贸泽芯城（深圳）电子科技有限公司	MH3292F16	RENESAS/瑞萨	23+	QFP	3000	一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、	询价
深圳市恒达亿科技有限公司	MH3296A28F16JE-4809	HIT	25+	QFP	4500	全新原装、诚信经营、公司现货销售!	询价
深圳市福安瓯科技有限公司	MH3294F16	N/A	25+	QFP	2500	强调现货,随时查询!	询价
艾睿（深圳）半导体有限公司	MH3261-601Y	BOURNS/伯恩斯	2447	C0603	100500	一级代理专营品牌!原装正品,优势现货,长期排单到货	询价
深圳市能元时代电子有限公司	MH3261-601Y	BOURNS	23+	SMD	12800	公司只有原装欢迎来电咨询。	询价
深圳市威尔健半导体有限公司	MH3294F16	N/A	23+	QFP	50000	全新原装正品现货,支持订货	询价
深圳市毅创腾电子科技有限公司	MH3278CP10	MITSUBIS	23+	PLCC	7000	绝对全新原装!100%保质量特价!请放心订购!	询价

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进口代理
2022-9-8
MHW820-2全新原装现货
可立即发货
2019-9-24
MGSF1N02LT1GON30V，2.1A，N沟道SOT-23产品大量库存
MGSF1N02LT1GON30V，2.1A，N沟道SOT-23产品大量库存
2019-3-29
MHCI04015-100M
MHCI04015-100M，全新原装当天发货或门市自取0755-82732291.
2019-3-28

DdatasheetPDF页码索引

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DdatasheetPDF页码索引