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MH16价格

参考价格:¥0.6287

型号:MH16 品牌:Apem 备注:这里有MH16多少钱,2026年最近7天走势,今日出价,今日竞价,MH16批发/采购报价,MH16行情走势销售排行榜,MH16报价。
型号 功能描述 生产厂家 企业 LOGO 操作
MH16

HIGH EFFICIENCY RECTIFIERS(1.0A,600-1000V)

MOSPEC

统懋

MH16

包装:散装 描述:CAP KEYSWITCH SQUARE RED 开关 配件 - 帽盖

ETC

知名厂家

MH16

高效率整流管

MOSPEC

统懋

磁条卡加密解码芯片

·符合PCI标准 \n·支持DES/TDES加密 \n·支持双向三磁道解码 \n·刷卡速度范围: 5cm/s-200cm/s \n·支持低幅度、噪音、高jitter等多种卡的解码\n·支持ISO, AAMVA, IBM 以及JIS II等标准格式卡;

MEGAHUNT

兆讯恒达

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

MH1608 Series High Current Chip Ferrite Beads

Features Compact size High current Wide impedance range RoHS compliant* and halogen free**

BOURNS

伯恩斯

1,073,741,824-BIT (16,777,216-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH16D64AKQC is 16777216 - word x 64-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 8 industry standard 8M x 16 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory mo

MITSUBISHI

三菱电机

1,073,741,824-BIT (16,777,216-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH16D64AKQC is 16777216 - word x 64-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 8 industry standard 8M x 16 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory mo

MITSUBISHI

三菱电机

1,207.959,552-BIT (16,777,216-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH16D72AKLB is 16777216 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 9 industry standard 16M x 8 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory mo

MITSUBISHI

三菱电机

1,207.959,552-BIT (16,777,216-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module

DESCRIPTION The MH16D72AKLB is 16777216 - word x 72-bit Double Data Rate(DDR) Sy nchronous DRAM mounted module. This consists of 9 industry standard 16M x 8 DDR Sy nchronous DRAMs in TSOP with SSTL_2 interf ace which achiev es v ery high speed data rate up to 133MHz. This socket-ty pe memory mo

MITSUBISHI

三菱电机

FAST PAGE MODE ( 16,777,216-WORD BY 40-BIT ) DYNAMIC RAM

DESCRIPTION The MH16M40AJD is a 16M word by 40-bit dynamic RAM module and consists of 10 industry standard 16M X 4 dynamic RAMs in a TSOP package. The ICs are mounted on both sides of two small PC boards (Ceracom) with the flash gold plating and form a convenient 69-pin WDIP package. FEATURES

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64AMA is 16777216 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx4 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high dens

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64AMA is 16777216 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx4 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high dens

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64AMA is 16777216 - word by 64-bit Synchronous DRAM module. This consists of sixteen industry standard 16Mx4 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high dens

MITSUBISHI

三菱电机

1,073,741,824-BIT (16,777,216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64APFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

MITSUBISHI

三菱电机

1,073,741,824-BIT (16,777,216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64APFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

MITSUBISHI

三菱电机

1,073,741,824-BIT (16,777,216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64APFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

MITSUBISHI

三菱电机

1,073,741,824-BIT (16,777,216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64APFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

MITSUBISHI

三菱电机

1,073,741,824-BIT (16,777,216 - WORD BY 64-BIT)Synchronous DRAM

DESCRIPTION The MH16S64APHB is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

MITSUBISHI

三菱电机

1,073,741,824-BIT (16,777,216 - WORD BY 64-BIT)Synchronous DRAM

DESCRIPTION The MH16S64APHB is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

MITSUBISHI

三菱电机

1,073,741,824-BIT (16,777,216 - WORD BY 64-BIT)Synchronous DRAM

DESCRIPTION The MH16S64APHB is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densi

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64BAMD is 16777216 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 8Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densiti

MITSUBISHI

三菱电机

1,073,741,824-BIT ( 16,777,216-WORD BY 64-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH16S64BAMD is 16777216 - word x 64-bit Synchronous DRAM module. This consist of sixteen industry standard 8M x 8 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. Th

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64BAMD is 16777216 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 8Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densiti

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64BAMD is 16777216 word X 64 bit Synchronous DRAM module. This consists of sixteen industry standard 8Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densiti

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64PFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64PFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64PFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64PFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64PFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64PFC is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64PHB is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1,073,741,824-BIT ( 16,777,216-WORD BY 64-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION The MH16S64PHB is 16777216 - word x 64-bit Synchronous DRAM module. This consist of eight industry standard 16M x 8 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. This

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64PHB is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION The MH16S64PHB is 16777216 - word by 64-bit Synchronous DRAM module. This consists of eight industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1207959552-BIT (16777216 - WORD BY 72-BIT)SynchronousDRAM

DESCRIPTION The MH16S72AMA is 16777216 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx4 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den

MITSUBISHI

三菱电机

1207959552-BIT (16777216 - WORD BY 72-BIT)SynchronousDRAM

DESCRIPTION The MH16S72AMA is 16777216 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx4 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den

MITSUBISHI

三菱电机

1207959552-BIT (16777216 - WORD BY 72-BIT)SynchronousDRAM

DESCRIPTION The MH16S72AMA is 16777216 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx4 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den

MITSUBISHI

三菱电机

1,207,959,552-BIT (16,777,216 - WORD BY 72-BIT)Synchronous DRAM

DESCRIPTION The MH16S72APHB is 16777216 - word by 72-bit Synchronous DRAM module. This consists of nine industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1,207,959,552-BIT (16,777,216 - WORD BY 72-BIT)Synchronous DRAM

DESCRIPTION The MH16S72APHB is 16777216 - word by 72-bit Synchronous DRAM module. This consists of nine industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

1,207,959,552-BIT (16,777,216 - WORD BY 72-BIT)Synchronous DRAM

DESCRIPTION The MH16S72APHB is 16777216 - word by 72-bit Synchronous DRAM module. This consists of nine industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densit

MITSUBISHI

三菱电机

MH16产品属性

  • 类型

    描述

  • @TC0C:

    1.0

  • VRM(V):

    150

  • IFSM(A):

    600

  • IR(uA):

    30

  • VF(V):

    5.0

  • TRR(nS):

    1.5

  • PACKAGE:

    100

  • Download:

    SMB

更新时间:2026-5-20 17:58:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
BOURNS
25+
N/A
20000
原装
Shantou
08+
液晶屏
789
原装现货海量库存欢迎咨询
megahuntm
24+
QFN
36000
进口原装现货假一赔十
M-TRON
25+
51
公司优势库存 热卖中!
megahuntmicro
24+
QFN
36520
一级代理/放心采购
MEGAHUNTM
24+
QFN-24
39500
进口原装现货 支持实单价优
BOURNS
23+
SMD被动器件正迈科技
99050
电容电阻被动器件电感磁珠系列样品可出支持批量
BOURNS/伯恩斯
2450+
SMD
6540
只做原厂原装现货或订货假一赔十!
MH
23+
ESOP-8
10201
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
Bourns(伯恩斯)
25+
标准封装
16883
我们只是原厂的搬运工

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