位置:首页 > IC中文资料第7168页 > MBF1
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
Schottky Surface Mount Flat Bridge Rectifier Features ◇ Low profile package ◇ Ideal for automated placement ◇ Ultrafast reverse recovery time ◇ Low power losses, high efficiency ◇ Low forward voltage drop ◇ High surge capability ◇ High temperature soldering: 260℃/10 seconds at terminals | LUGUANG 鲁光电子 | |||
Silicon Bridge Rectifiers Features ● Glass passivated junction ● High surge current capability ● Saves space on printed circuit boards ● High temperature soldering guaranteed: 260°C/10 seconds ● RoHS Compliant Mechanical Data ● Case: Molded plastic body RoHS-compliant ● Molding compound meets UL 94 V-0 flammability | BILIN 银河微电 | |||
Silicon Bridge Rectifiers Features ● Glass passivated junction ● High surge current capability ● Saves space on printed circuit boards ● High temperature soldering guaranteed: 260°C/10 seconds ● RoHS Compliant Mechanical Data ● Case: Molded plastic body RoHS-compliant ● Molding compound meets UL 94 V-0 flammability | BILIN 银河微电 | |||
Silicon Bridge Rectifiers Features ● Glass passivated junction ● High surge current capability ● Saves space on printed circuit boards ● High temperature soldering guaranteed: 260°C/10 seconds ● RoHS Compliant Mechanical Data ● Case: Molded plastic body RoHS-compliant ● Molding compound meets UL 94 V-0 flammability | BILIN 银河微电 | |||
Silicon Bridge Rectifiers Features ● Glass passivated junction ● High surge current capability ● Saves space on printed circuit boards ● High temperature soldering guaranteed: 260°C/10 seconds ● RoHS Compliant Mechanical Data ● Case: Molded plastic body RoHS-compliant ● Molding compound meets UL 94 V-0 flammability | BILIN 银河微电 | |||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate | Fujitsu 富士通 | |||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate | Fujitsu 富士通 | |||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate | Fujitsu 富士通 | |||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate | Fujitsu 富士通 | |||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate | Fujitsu 富士通 | |||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate | Fujitsu 富士通 | |||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate | Fujitsu 富士通 | |||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate | Fujitsu 富士通 | |||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate | Fujitsu 富士通 | |||
Silicon Bridge Rectifiers Features ● Glass passivated junction ● High surge current capability ● Saves space on printed circuit boards ● High temperature soldering guaranteed: 260°C/10 seconds ● RoHS Compliant Mechanical Data ● Case: Molded plastic body RoHS-compliant ● Molding compound meets UL 94 V-0 flammability | BILIN 银河微电 | |||
650V Field Stop IGBT General Description This IGBT is produced using advanced MagnaChip’s Field Stop Trench IGBT Technology, which provides high performance, excellent quality and high ruggedness. This device is for motor control. Features ■ High ruggedness for motor control ■ VCE(sat) positive temperature coeffi | MGCHIP | |||
1A,800V, Surface Mount Bridge Rectifiers | GALAXY 银河微电 | |||
Solid-State Fingerprint Sensor | Fujitsu 富士通 | |||
肖特基整流桥 | JINGDAO 晶导 | |||
包装:散装 描述:ACCY MOUNT BMM 3/4\ RF/IF,射频/中频和 RFID RF 配件 | ETC 知名厂家 | ETC | ||
包装:散装 描述:ACCY MOUNT BMM 3/4\ RF/IF,射频/中频和 RFID RF 配件 | ETC 知名厂家 | ETC |
MBF1产品属性
- 类型
描述
- 型号
MBF1
- 制造商
FUJITSU
- 制造商全称
Fujitsu Component Limited.
- 功能描述
Solid-State Fingerprint Sensor
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
FUJITSU/富士通 |
23+ |
TSOP-80 |
89630 |
当天发货全新原装现货 |
|||
FUJITSU |
23+ |
SSOP80 |
8560 |
受权代理!全新原装现货特价热卖! |
|||
FUJITSU/富士通 |
24+ |
NA/ |
3389 |
原装现货,当天可交货,原型号开票 |
|||
HITACHI |
23+ |
DIP |
12000 |
全新原装假一赔十 |
|||
MAGNACHIP |
1932+ |
TO-220F |
1010 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
FUJ |
25+ |
DIP-8 |
18000 |
原厂直接发货进口原装 |
|||
FUJITSU/富士通 |
23+ |
TSOP80 |
66600 |
专业芯片配单原装正品假一罚十 |
|||
FUJITSU/富士通 |
25+ |
SSOP80 |
15000 |
一级代理原装现货 |
|||
FUJISTU |
18+ |
FUJITSU |
85600 |
保证进口原装可开17%增值税发票 |
|||
FUJITSU/富士通 |
2223+ |
TSOP80 |
26800 |
只做原装正品假一赔十为客户做到零风险 |
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2019-3-7
DdatasheetPDF页码索引
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