超低功耗、宽动态范围、7.5Msps模拟前端

MAX5863超低功耗、高集成度模拟前端可理想用于便携式通信设备，如手机、PDA、WLAN以及3G无线终端。MAX5863集成双路8位接收ADC和双路10位发送DAC，能以极低的功耗提供较高的动态性能。ADC的模拟I-Q输入放大器为全差分结构，可接受1VP-P满量程信号。I-Q通道的典型相位匹配为±0.03°，幅度匹配为±0.03dB。在fIN = 1.875MHz和fCLK = 7.5Msps时，ADC的SINAD为48.5dB，无杂散动态范围(SFDR)为69dBc。DAC的模拟I-Q输出为全差分结构，满量程输出为±400mV，共模电压为1.4V。I-Q通道的典型相位匹配为±0.15°，增 • 集成双路8位ADC与双路10位DAC \n• fCLK = 7.5MHz时22.8mW (收发器模式) \n• 低电流空闲和关断模式 \n• fIN = 1.875MHz时SINAD为48.5dB (ADC) \n• 优异的增益/相位匹配 \n• 内部/外部基准选择 \n• 为ADC/DAC提供并行数字输入/输出复用 \n• 可提供评估板(请定购MAX5865EVKIT);

Ultra-Low-Power, High-Dynamic Performance, 7.5Msps Analog Front End

文件：1.67311 Mbytes Page：26 Pages

Ultra-Low-Power, High-Dynamic Performance, 7.5Msps Analog Front End

文件：1.67311 Mbytes Page：26 Pages

Ultra-Low-Power, High-Dynamic Performance, 7.5Msps Analog Front End

文件：1.67311 Mbytes Page：26 Pages

Ultra-Low-Power, High-Dynamic Performance, 7.5Msps Analog Front End

文件：1.67311 Mbytes Page：26 Pages

封装/外壳：48-WFQFN 裸露焊盘 包装：卷带（TR） 描述：IC AFE 8/10BIT 7.5MSPS 48-TQFN 集成电路（IC） 模拟前端（AFE）

封装/外壳：48-WFQFN 裸露焊盘 包装：管件 描述：IC AFE 4 CHAN 8/10BIT 48TQFN 集成电路（IC） 模拟前端（AFE）

8192 word x 8-bit High Speed CMOS Static RAM

Description CXK5863AP / AJ are 65,536 bits high speed CMOS static RAMS organized as 8,192 words by 8-bits and operate from a singel 5V supply. These devices are suitable for use in high speed applications such as cash memory.

4-BIT SINGLE CHIP MICROCOMPUTER

4-Bit Single Chip Microcomputer (On-Chip LCD Driver, 12K/16K-Byte ROM, 1K-Bit RAM) The LC5863H/64H are CMOS type 4-bit singel chip microcomputers with internal 6K/8K-byte ROM, 1K-bit RAM and LCD driver. The internal function of the LC5863H/64H microcomputers cap operate at low voltage level. App