封装/外壳：32-TQFP 裸露焊盘 包装：散装 描述：IC TIME-TO-DGTL CONV W/AFE TQFP 集成电路（IC） 传感器和检测器接口

Time-to-Digital Converter with Analog Front-End

文件：1.48267 Mbytes Page：66 Pages

Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

Contactless Memory Chip 13.56 MHz, 2048-bit High Endurance EEPROM

DESCRIPTION The M35101 is a contactless memory, powered by the received carrier electromagnetic wave. It is a 2048-bit EEPROM, organised as 16 pages of 16 x 8 bits. ■ ISO 14443-2 Type-B Standard Compliant ■ 13.56 MHz Carrier Frequency ■ 847 kHz Subcarrier Frequency ■ 106 Kbit/second Data Tran

RADIAL LEADED INDUCTORS

文件：670.06 Kbytes Page：8 Pages

Pocket / Laptop Modem Couplers

文件：21.23 Kbytes Page：1 Pages