Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Ground Wrap to Top (No ground bonding required)\n·Very Good Stability Over Temperature (TCR16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz;

封装/外壳：模具 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：ATTENUATOR,DIE,17DB RF/IF，射频/中频和 RFID 衰减器

Attenuator DIE

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SILICON SURGE SUPPRESSOR DIODES

[LEDEX]

SILICON SURGE SUPPRESSOR DIODES

[LEDEX]

RGB color sensor integrated in small and thin package

S10170 is a color sensor molded into a plastic package having a 3-channel (RGB) photodiode sensitive to the Red (λ=590 nm Min.), Green (λ=480 to 600 nm) and Blue (λ=400 to 540 nm) regions of the spectrum. When compared to the previous model (S9702), S10170 is significantly miniaturized the package

High voltage power Schottky rectifier

Description Dual centre tab Schottky rectifier designed for high frequency switch mode power supplies. Features and benefits ■ High junction temperature capability ■ Good trade-off between leakage current and forward voltage drop ■ Low leakage current ■ Avalanche capability spe

High voltage power Schottky rectifier

Description Dual centre tab Schottky rectifier designed for high frequency switch mode power supplies. Features and benefits ■ High junction temperature capability ■ Good trade-off between leakage current and forward voltage drop ■ Low leakage current ■ Avalanche capability spe