Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Return Loss > 16 dB 13 to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz\n·Flat Response From DC to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Ground Wrap to Top (No ground bonding required)\n·Very Good Stability Over Temperature (T;

封装/外壳：模具 包装：卷带（TR） 描述：RF ATTENUATOR 6DB DIE RF/IF，射频/中频和 RFID 衰减器

Attenuator DIE

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100 Amp Rectifier 20 to 100 Volts Schottky Barrier

Features • Metal of siliconrectifier, majonty carrier conducton • Guard ring for transient protection • Low power loss high efficiency • High surge capacity, High current capability

100 Amp Supre Fast Recovery Rectifier 50 to 600 Volts

Features • High Surge Capability • Low Leakage • Low Forward Voltage Drop • High Current Capability • Supre Fast switching for high efficiency

100A, 600V Hyperfast Diode

100A, 600V Hyperfast Diode The RHRU10060 is a hyperfast diode with soft recovery characteristics (trr

100A, 600V Ultrafast Diode

The RURU10060 is an ultrafast diode with soft recovery characteristics (trr Features • Ultrafast with Soft Recovery . . . . . . . . . . . . . . . . . . .

100 Amp Supre Fast Recovery Rectifier 50 to 600 Volts

Features • High Surge Capability • Low Leakage • Low Forward Voltage Drop • High Current Capability • Supre Fast switching for high efficiency