Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·DC to 40 GHz\n·Medium Power Handling 2W CW\n·Flat Response From DC to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Return Loss > 16 dB 13 to 40 GHz\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Very Good Stability Over Temperature (TCR < 100 PPM)\n·Ground Wrap to Top (No ground bond;

封装/外壳：模具 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：RF ATTENUATOR 3DB DIE RF/IF，射频/中频和 RFID 衰减器

Attenuator DIE

文件：460.03 Kbytes Page：3 Pages

100 Amp Rectifier 20 to 100 Volts Schottky Barrier

Features • Metal of siliconrectifier, majonty carrier conducton • Guard ring for transient protection • Low power loss high efficiency • High surge capacity, High current capability

Schottky PowerMod

Schottky PowerMod ● Schottky Barrier Rectifier ● Guard Ring for Reverse Protection ● Low forward voltage ● VRRM 30 to 45 Volts ● Electrically isolated base ● Reverse Energy Tested ● Center tap ● ROHS Compliant

10-Bit, 30 MSPS, 125 mW A/D Converter with Internal Sample and Hold

文件：417.65 Kbytes Page：17 Pages

10-Bit, 30 MSPS, 125 mW A/D Converter with Internal Sample and Hold

文件：417.65 Kbytes Page：17 Pages

ZERO RECOVERY RECTIFIER

文件：253.59 Kbytes Page：5 Pages