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M47价格
参考价格:¥377.8780
型号:M471B5173EB0-YK000 品牌:SAM 备注:这里有M47多少钱,2024年最近7天走势,今日出价,今日竞价,M47批发/采购报价,M47行情走势销售排行榜,M47报价。型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
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M4700 SERIES AC/DC POWER SUPPLY PRODUCTHIGHLIGHTS VITA62COMPLIANT 6UVPXFORMFACTOR AC/DCCONVERTER Upto1000WSteadyState Cybersecure | ENERCON Enercon Technologies Europe AG | |||
M4701 SERIES AC/DC POWER SUPPLY PRODUCTHIGHLIGHTS VITA62COMPLIANT 6UVPXFORMFACTOR SOSATMALIGNED AC/DCCONVERTER Upto1200WSteadyState 1500WPeakPower CyberSecure | ENERCON Enercon Technologies Europe AG | |||
M4703 SERIES DC/DC POWER SUPPLY PRODUCTHIGHLIGHTS VITA62COMPLIANT 6UVPXFORMFACTOR SOSATMALIGNED DC/DCCONVERTER Upto1200WSteadyState CyberSecure | ENERCON Enercon Technologies Europe AG | |||
M4705 SERIES AC/DC POWER SUPPLY PRODUCTHIGHLIGHTS VITA62COMPLIANT VITA48.7ClassAAFBCOMPLIANT 6UVPXFORMFACTOR SOSATMALIGNED AC/DCCONVERTER Upto1200WSteadyState CyberSecure | ENERCON Enercon Technologies Europe AG | |||
M4706 SERIES AC/DC POWER SUPPLY PRODUCTHIGHLIGHTS VITA62COMPLIANT VITA48.7ClassAAFBCOMPLIANT 6UVPXFORMFACTOR SOSATMALIGNED AC/DCCONVERTER Upto1200WSteadyState 100W@50mSecHoldup CyberSecure | ENERCON Enercon Technologies Europe AG | |||
M4707 SERIES DC/DC POWER SUPPLY PRODUCTHIGHLIGHTS VITA62COMPLIANT VITA48.7ClassAAFBCOMPLIANT 6UVPXFORMFACTOR SOSATMALIGNED DC/DCCONVERTER Upto1200WSteadyState 1500WPeakPower CyberSecure | ENERCON Enercon Technologies Europe AG | |||
DDR SDRAM SODIMM 200PinNonECC/ECCSODIMMbasedon256MbF-die(x16) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwi | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM 200PinNonECC/ECCSODIMMbasedon256MbF-die(x16) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwi | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM 200PinNonECC/ECCSODIMMbasedon256MbF-die(x16) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwi | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM 200PinNonECC/ECCSODIMMbasedon256MbF-die(x16) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwi | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM Product Guide ConsumerMemory | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3223DT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonthirdgenof256MbDDRSDRAMrespectively. TheSamsungM470L3223DT0consistsofeightCMOS32Mx8bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesmo | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3223DT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonthirdgenof256MbDDRSDRAMrespectively. TheSamsungM470L3223DT0consistsofeightCMOS32Mx8bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesmo | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3223DT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonthirdgenof256MbDDRSDRAMrespectively. TheSamsungM470L3223DT0consistsofeightCMOS32Mx8bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesmo | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3223DT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonthirdgenof256MbDDRSDRAMrespectively. TheSamsungM470L3223DT0consistsofeightCMOS32Mx8bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesmo | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3223DT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonthirdgenof256MbDDRSDRAMrespectively. TheSamsungM470L3223DT0consistsofeightCMOS32Mx8bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesmo | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3223DT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonthirdgenof256MbDDRSDRAMrespectively. TheSamsungM470L3223DT0consistsofeightCMOS32Mx8bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesmo | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3223DT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonthirdgenof256MbDDRSDRAMrespectively. TheSamsungM470L3223DT0consistsofeightCMOS32Mx8bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesmo | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3223DT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonthirdgenof256MbDDRSDRAMrespectively. TheSamsungM470L3223DT0consistsofeightCMOS32Mx8bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesmo | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3223DT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonthirdgenof256MbDDRSDRAMrespectively. TheSamsungM470L3223DT0consistsofeightCMOS32Mx8bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesmo | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3224BT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonfirstgenof256MbDDRSDRAMrespectively. TheSamsungM470L3224BT0consistsofeightCMOS16Mx16bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesm | SamsungSamsung Group 三星三星半导体 | |||
256MB DDR SDRAM MODULE GENERALDESCRIPTION TheSamsungM470L3224BT0is32Mbitx64DoubleDataRateSDRAMhighdensitymemorymodulesbasedonfirstgenof256MbDDRSDRAMrespectively. TheSamsungM470L3224BT0consistsofeightCMOS16Mx16bitwith4banksDoubleDataRateSDRAMsin66pinTSOP-II(400mil)packagesm | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM 200PinNonECC/ECCSODIMMbasedon256MbF-die(x16) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwi | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM 200PinNonECC/ECCSODIMMbasedon256MbF-die(x16) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwi | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM 200PinNonECC/ECCSODIMMbasedon256MbF-die(x16) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwi | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM 200PinNonECC/ECCSODIMMbasedon256MbF-die(x16) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwi | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM SODIMM Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM Product Guide ConsumerMemory | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM Product Guide ConsumerMemory | SamsungSamsung Group 三星三星半导体 | |||
512MB Unbuffered SODIMM(based on sTSOP) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
512MB Unbuffered SODIMM(based on sTSOP) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
512MB Unbuffered SODIMM(based on sTSOP) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
512MB Unbuffered SODIMM(based on sTSOP) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
512MB Unbuffered SODIMM(based on sTSOP) Feature •Powersupply:Vdd:2.5V±0.2V,Vddq:2.5V±0.2V •Double-data-ratearchitecture;twodatatransfersperclockcycle •Bidirectionaldatastrobe(DQS) •Differentialclockinputs(CKandCK) •DLLalignsDQandDQStransitionwithCKtransition •ProgrammableReadlatency2,2.5(c | SamsungSamsung Group 三星三星半导体 | |||
DDR SDRAM Product Guide ConsumerMemory | SamsungSamsung Group 三星三星半导体 | |||
DDR2 SDRAM Memory ConsumerMemory | SamsungSamsung Group 三星三星半导体 | |||
DDR2 SDRAM Memory ConsumerMemory | SamsungSamsung Group 三星三星半导体 | |||
DDR2 SDRAM Memory ConsumerMemory | SamsungSamsung Group 三星三星半导体 | |||
DDR2 SDRAM Memory ConsumerMemory | SamsungSamsung Group 三星三星半导体 | |||
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAdditiveLatency:0,1,2,3and4 •WriteLatency(WL)=Re | SamsungSamsung Group 三星三星半导体 | |||
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAdditiveLatency:0,1,2,3and4 •WriteLatency(WL)=Re | SamsungSamsung Group 三星三星半导体 | |||
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAdditiveLatency:0,1,2,3and4 •WriteLatency(WL)=Re | SamsungSamsung Group 三星三星半导体 | |||
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAdditiveLatency:0,1,2,3and4 •WriteLatency(WL)=Re | SamsungSamsung Group 三星三星半导体 | |||
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAdditiveLatency:0,1,2,3and4 •WriteLatency(WL)=Re | SamsungSamsung Group 三星三星半导体 | |||
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAdditiveLatency:0,1,2,3and4 •WriteLatency(WL)=Re | SamsungSamsung Group 三星三星半导体 | |||
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAdditiveLatency:0,1,2,3and4 •WriteLatency(WL)=Re | SamsungSamsung Group 三星三星半导体 | |||
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAdditiveLatency:0,1,2,3and4 •WriteLatency(WL)=Re | SamsungSamsung Group 三星三星半导体 | |||
DDR2 Unbuffered SODIMM Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd | SamsungSamsung Group 三星三星半导体 | |||
DDR2 Unbuffered SODIMM Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd | SamsungSamsung Group 三星三星半导体 | |||
DDR2 Unbuffered SODIMM 200pin Unbuffered SODIMM based on 512Mb C-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd | SamsungSamsung Group 三星三星半导体 | |||
DDR2 Unbuffered SODIMM 200pin Unbuffered SODIMM based on 512Mb C-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd | SamsungSamsung Group 三星三星半导体 | |||
DDR2 Unbuffered SODIMM Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd | SamsungSamsung Group 三星三星半导体 | |||
DDR2 Unbuffered SODIMM 200pin Unbuffered SODIMM based on 512Mb C-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd | SamsungSamsung Group 三星三星半导体 | |||
DDR2 Unbuffered SODIMM 200pin Unbuffered SODIMM based on 512Mb C-die 64bit Non-ECC Features •Performancerange •JEDECstandard1.8V±0.1VPowerSupply •VDDQ=1.8V±0.1V •200MHzfCKfor400Mb/sec/pin,267MHzfCKfor533Mb/sec/pin,333MHzfCKfor667Mb/sec/pin,400MHzfCKfor800Mb/sec/pin •4Banks •PostedCAS •ProgrammableCASLatency:3,4,5 •ProgrammableAd | SamsungSamsung Group 三星三星半导体 |
M47产品属性
- 类型
描述
- 型号
M47
- 制造商
OSRAM
- 功能描述
Tungsten halogen capsule lamp,20W 12Vac
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
MICROCHIP/微芯 |
2339+ |
UQFN-6 |
32280 |
原装现货 假一罚十!十年信誉只做原装! |
|||
MITSUBIS |
22+ |
SSOP34 |
6980 |
原装现货,可开13%税票 |
|||
TI/TEXAS |
23+ |
DIP |
8931 |
||||
SAMSUNG/三星 |
SODIMM |
68900 |
原包原标签100%进口原装常备现货! |
||||
SMART |
0644 |
DDR1SO-DIMM/256MBDDR1SO/ |
239 |
原装香港现货真实库存。低价 |
|||
SAMSUNG/三星 |
N/A |
90000 |
集团化配单-有更多数量-免费送样-原包装正品现货-正规 |
||||
SAM |
300 |
||||||
SAMSUNG |
2023+ |
SMD |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
|||
SAMSUNG |
21+ |
SODIMM |
35200 |
一级代理/放心采购 |
|||
23+ |
N/A |
89950 |
正品授权货源可靠 |
M47规格书下载地址
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- M-47-427
- M471B5173EB0-YK000
- M46-SL
- M46-OLB
- M46-OL
- M46-DL
- M4683
- M4670
- M4666-100
- M4665
- M46-30
- M46-29
- M46-28T
- M46-28
- M45PE80-VMW6G
- M45PE80-VMP6TG
- M45PE80-VMP6G
- M45PE80-VMN6P
- M45PE80
- M45PE40-VMW6G
- M45PE40-VMP6G
- M45PE40
- M45PE20-VMP6TG
- M45PE20-VMP6G
- M45PE20-VMN6TP
- M45PE20-VMN6P
- M45PE20
- M45PE16-VMP6TG
- M45PE16-VMP6G
- M45PE16
- M45PE10-VMN6TP
- M45PE10
- M4569
- M4565
- M4524GBW-SM
- M4524GBM-SM
- M4524GBH
- M4521
- M4519
- M4518
- M4517
- M4511
M47数据表相关新闻
M430F448
M430F448
2023-5-16M453VG6AE 原装现货 特价销售
只做原装正品,原包装标签欢迎咨询!
2021-9-10M451VG6AE现货全新进口原装
焕盛达竭诚为您提供一站式配套服务。当天下单,当天发货;
2020-10-29M48T02-150PC1
+125C实时时钟,Serial实时时钟,Serial,3-Wire实时时钟,SOIC-8+125C实时时钟,SOIC-8实时时钟,BackupSwitching实时时钟
2020-9-10M471A5244CB0-CTD
M471A5244CB0-CTD
2020-4-21M471A5244CB0-CRC
M471A5244CB0-CRC
2020-4-21
DdatasheetPDF页码索引
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