• Chip area 1:1.1 aspect ratio: matched to TI’s 0.55” XGA DLP for

3D printing applications

• Low thermal resistance package, Rth, j-c = 1.6°C/W

• Typical peak wavelength 405 nm

• 6.6W typical optical power

• Operation at up to 6A DC

• Low-profile window for efficient coupling into optical systems of fibers

• RoHS and REACh compliant