MEMS motion sensor: dual axis pitch and roll 짹300째/s analog gyroscope

STMICROELECTRONICS Analog ICs GYROSCOPES ST’s complete family of single-axis (yaw) and two-axis (pitch-and-roll, pitch-and-yaw) MEMS gyroscopes offers the industry’s widest full-scale range, from 30 to 6000°/s. The innovatively designed sensors can provide two separate outputs for each axis at

STMICROELECTRONICS Analog ICs

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MEMS motion sensor: dual axis pitch and roll ±300°/s analog gyroscope

MEMS motion sensor: dual axis pitch and roll 짹300째/s analog gyroscope

STMICROELECTRONICS Analog ICs GYROSCOPES ST’s complete family of single-axis (yaw) and two-axis (pitch-and-roll, pitch-and-yaw) MEMS gyroscopes offers the industry’s widest full-scale range, from 30 to 6000°/s. The innovatively designed sensors can provide two separate outputs for each axis at

STMICROELECTRONICS Analog ICs

文件：165.8 Kbytes Page：1 Pages

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PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

Pentium 4 Processors Supporting Hyper-Threading Technology

Introduction The Intel® Pentium® 4 processor on 90 nm process in the 775-land package is a follow on to the Pentium 4 processor in the 478-pin package with enhancements to the Intel NetBurst® microarchitecture. The Pentium 4 processor on 90 nm process in the 775-land package uses FlipChip Land Gr

Intel짰 Solid-State Drive 530 Series (2.5-inch)

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