型号 功能描述 生产厂家&企业 LOGO 操作
LMH0070SQESLASHNOPB

3Gbps,HD,SD,DVB-ASISDISerializerandCableDriverWithLVDSInterface

1FEATURES 2•LVDSInterfacetoHostFPGA •NoExternalVCOorClockRefRequired •IntegratedVariableOutputCableDriver •3.3VSMBusConfigurationInterface •IntegratedTXCLKPLLCleansClockNoise •Small48-PinWQFNPackage •IndustrialTemperaturerange:-40°Cto85°C APPLICATIONS

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2
LMH0070SQESLASHNOPB

3Gbps,HD,SD,DVB-ASISDISerializerandCableDriverWithLVDSInterface

文件:926.94 Kbytes Page:30 Pages

TI1Texas Instruments

德州仪器美国德州仪器公司

TI1

3Gbps,HD,SD,DVB-ASISDISerializerandCableDriverWithLVDSInterface

1FEATURES 2•LVDSInterfacetoHostFPGA •NoExternalVCOorClockRefRequired •IntegratedVariableOutputCableDriver •3.3VSMBusConfigurationInterface •IntegratedTXCLKPLLCleansClockNoise •Small48-PinWQFNPackage •IndustrialTemperaturerange:-40°Cto85°C APPLICATIONS

TI2Texas Instruments

德州仪器美国德州仪器公司

TI2

10.1Medical-GradeTabletwithIntel®Atom™ProcessorandPCAPTouchscreen

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒIntel®Atom™processorwithsupportforbothWindowsandAndroidOS ƒ10.1fullHDprojectedcapacitivetouchscreenwithscratch-resistant Corning®Gorilla®Glass ƒSupportsactivestyluspen,glovedoperation,

ADVANTECHAdvantech Co., Ltd.

研华科技研华科技(中国)有限公司

ADVANTECH

8Industrial-GradeTabletwithQualcomm®Snapdragon™660Processor,Android12withAndroidEnterpriseRecommended

Features ƒQualcomm®Snapdragon™660processorwithAndroid12andAndroid EnterpriseRecommendedcertification ƒ8industrial-gradeLCDwith1920x1200resolution,400-nitbrightness,and upto12,000hoursMTBF ƒProjectedcapacitivetouchscreenwithscratch-resistantCorning®Gorilla® Glas

ADVANTECHAdvantech Co., Ltd.

研华科技研华科技(中国)有限公司

ADVANTECH

10.1MedicalGradeTabletwithQualcomm®Snapdragon™660

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒQualcommSDA660withAndroid10 ƒ10.1Full-HDcapacitivetouchscreendesignedwithscratch-resistant Corning®Gorilla®Glass ƒSupportsglovemodeandstyluswithpalmdetectiontoexpandusability ƒIntegra

ADVANTECHAdvantech Co., Ltd.

研华科技研华科技(中国)有限公司

ADVANTECH

InternallyMatchedLNAModule

文件:519.6 Kbytes Page:3 Pages

ASB

Advanced Semiconductor Business Inc.

ASB

InternallyMatchedLNAModule

文件:220.87 Kbytes Page:3 Pages

ASB

Advanced Semiconductor Business Inc.

ASB
更新时间:2025-7-28 20:12:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
20+
NA
53650
TI原装主营-可开原型号增税票
TI/德州仪器
25+
QFP
880000
明嘉莱只做原装正品现货
TI
18
QFP
530
一级代理,专注军工、汽车、医疗、工业、新能源、电力
TI
2016+
QFP
2585
只做进口原装现货!或者订货,假一赔十!
TI
23+
N/A
560
原厂原装
TI
24+
SMD
1680
TI一级代理商专营进口原装现货假一赔十
NS
22+
LLP
3000
原装正品,支持实单
22+
5000
TI
23+
QFP
3200
正规渠道,只有原装!
TI/德州仪器
24+
QFP
875
只供应原装正品 欢迎询价

LMH0070SQESLASHNOPB芯片相关品牌

  • 3M
  • AVX
  • ECE
  • GSI
  • MA-COM
  • MARL
  • MORNSUN
  • PCA
  • PF
  • RENESAS
  • TTELEC
  • XFMRS

LMH0070SQESLASHNOPB数据表相关新闻